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YSi-SP

YSi-SP 3D solder paste inspection machine from Yamaha – High speed and precision in SMT inspection

The YSi-SP 3D solder paste inspection machine from Yamaha is a high-speed SPI (solder paste inspection) solution that has been specially developed for precise and efficient inspections in modern SMT production lines. As part of the Yamaha Total Line Solution, it enables seamless integration into placement and printing processes while offering maximum measurement accuracy and process control.

With its single-head solution, Yamaha’s YSi-SP 3D solder paste inspection machine performs multiple types of inspection with just one head—for maximum efficiency and precision while reducing the space required in production.

High-precision 3D+2D inspection in one system

The YSi-SP combines 3D and 2D inspections in a single, powerful system. It reliably detects even the smallest deviations in solder paste application, volume, height, or offset.
Thanks to variable image resolution switching, both large areas and highly detailed areas can be inspected with precision—perfect for complex PCB layouts with different structures.

The high-speed camera and powerful image processing processor guarantee short inspection times without compromising accuracy.

Full integration with the Yamaha Total Line Solution

The YSi-SP 3D solder paste inspection machine is fully compatible with other Yamaha systems and, together with the printer, placement machine, dispenser, and AOI, forms the backbone of the Yamaha Total Line Solution—a true one-stop shop for end-to-end SMT manufacturing.
The YSi-SP exchanges data with upstream and downstream processes via the M2M (machine-to-machine) communication interface. This enables real-time corrections, which reduces scrap and significantly increases overall equipment effectiveness (OEE).

Enhanced process control and flexibility

Integrated statistical process control (SPC) provides accurate production data in real time and supports predictive maintenance and process optimization.
Optional modules allow easy adaptation to different product sizes and types, making Yamaha’s YSi-SP 3D solder paste inspection machine ideal for changing production requirements.

Advantages at a glance

  • Single-head solution for 3D+2D inspection

  • High-speed and high-precision technology

  • SPC data analysis for process optimization

  • M2M communication for closed control loops

  • Integration into Yamaha Total Line Solution

  • Flexible adaptation to different product types

Further technical information can be found on the official Yamaha website.

Model

YSi-SP
Applicable PCB

Single-track: L 510 x W 460 mm (max .) to L 50 x W 50 mm (min.) * PCB thickness 0.3-5.0 mm
Horizontal resolution

1) 25 µm / 12,5 µm (ca. 50*50 mm)

2) 20 µm / 10 µm (ca. 40*40 mm)

3) 15 µm / 7,5 µm (ca. 30*30 mm) * Einzelprojektor

Standard-Profiltypen

Doppelprojektor
Inspection Speed Resolution 25 (12.5) µm Resolution 20 (10) µm Resolution 15 (7.5) µm Accuracy Volume according to Sigma 3
  • Standard (high resolution)
    8,900 (5,600) mm²/s
    5,700 (3,500) mm²/s
    3,200 (1,900) mm²/s
    2
  • Standard (high resolution)
    9,400 (6,000) mm²/s
    6,000 (3,700) mm²/s
    3,300 (2,000) mm²/s
    3
Field of application

Quality of the plumb print (quantity, height, area, misalignment)
Power supply

1 Phasig AC-200/208/220/230/240 V +/- 10%
Air supply source

none
External dimension

L 904 x W 1.080 x H 1.478 mm
Weight

Approx. 550 kg
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