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YSi-V

YSi-V AOI-System

Yamaha YSi-V AOI System – Precise 2D, 3D, and 4D inspection for the highest quality

Yamaha’s YSi-V AOI system is an innovative hybrid high-end inspection system for automatic optical inspection (AOI) in electronics manufacturing. With its newly developed high-speed and high-resolution technology, the system sets new standards in precision and efficiency. The YSi-V 12M Type HS2 combines state-of-the-art camera technology with intelligent image processing, making it the perfect solution for demanding quality control in SMT production lines.

High-performance inspection with 2D, 3D, and 4D technology

Yamaha’s YSi-V AOI systems offer three powerful inspection functions in one device:

  • 2D inspection: High-resolution, two-dimensional visual inspection for fast and accurate defect detection.

  • 3D inspection: Detection of height differences and sloping surfaces for precise component analysis.

  • 4D image inspection: Four side cameras enable diagonal angle shooting for a complete view of the component.

This combination enables Yamaha’s YSi-V AOI system to reliably detect even the smallest defects in solder joints, component placement, and surface finish.

Speed meets precision

With its high-speed image processing and high-resolution camera technology, the system delivers accurate results in record time. Simultaneous processing of 2D, 3D, and 4D data significantly reduces inspection times and ensures maximum productivity. This makes Yamaha’s YSi-V AOI system the ideal solution for automated SMT lines with high volume and quality requirements.

Integration into the Yamaha Total Line Solution

The YSi-V series perfectly complements Yamaha’s Total Line Solution. Combined with placement machines, dispensers, and printing systems, it creates a fully integrated production system—a true one-stop shop for efficient SMT manufacturing. This allows you to benefit from continuous process monitoring and maximum quality assurance.

Intelligent image processing and user-friendliness

Yamaha’s exclusive image capture and evaluation technology enables precise fault classification and minimizes false alarms. The system is intuitive to use, easy to program, and supports quick changeovers when switching products—ideal for modern electronics manufacturing with changing series.

For further technical information, visit the official Yamaha website.

Model

YSi-V
Applicable PCB

Single lane: L 610 x W 560 mm (max .) to L 50 x W 50 mm (min.) * L750 mm possible as an option
Inspection camera

12Megapixel (High-End) 5Megapixel (Standard)
Resolution
  • 12 M TypeHS (12 µm, 7 µm)
    12 M TypeS (12 µm, 7 µm)
    12 M TypeDF (12 µm)
  • 5m (18µm)
Field of application

Component status after assembly, component status and soldering results after hardening
Power supply

3-phase alternating current 200/208/220/230/240/400/416 V +/- 10% 50/60 Hz
Air supply source

0.45 MPa or more, clean/dry
Externe Dimension

L 1252 x W 1498 x H 1,550 mm (without projections)
Weight

Approx. 1300 kg
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