The YAMAHA YSH20 is a high-speed flip chip hybrid placement machine with maximum precision. With a performance of 4,500 UPH (0.8 s/unit), it is ideal for flexible applications that go beyond simple flip chip placement.
The YAMAHA YSH20 has an outstanding mounting accuracy of +/- 10μm (3σ) (when using standard Yamaha components).
With YWF wafer supply unit for 6/8/12 inch wafers, “Expand Ring” and “θ angle correction” are applicable on the YSH20.

  • 4,500 UPH (0.8 sec/unit); upper mounting capability in flip-chip bonder
  • +/- 10 µm (3σ) Assembly accuracy
  • YWF Wafer Supply Unit “6/8/12 Inch,” “Extend Ring,” and “θ Angle Correction”
  • 0.6 x 0.6 mm to 18 × 18 mm components applicable


Approx. 2470 kg (main unit only)

Model YSH20

Applicable PCB
L 50 x w 30 mm to L 250 x w 200 mm
** “Bis zu L 340 x B 340 mm” anwendbar. Bitte kontaktieren Sie uns für weitere Details.
  • Assembly accuracy (for Yamaha standard components)
[2F2F Heads & Multi-Camera Type]
Repeatability (3): +/- 0.010 mm / unit +/- 0.05 degrees
[4M4M Heads & Multi-Camera Type] ** Under development
Repeatability (3): +/- 0.010 mm / unit +/- 0.05 degrees
  • Assembly capability (under optimal conditions)
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** without dipping 3,600 UPH (1.0 sec/unit) ** including dipping
[4M4M Heads & Multi-Camera Type] ** under development 5,500 UPH (0.65 sec/unit) ** without dipping 4,500 cards per hour (0.8 sec/unit) ** including dipping
Component supply configuration Wafer (6/8/12-inch flat ring), waffle tray, roll reel (8/12/16 mm width)
Applicable components [Multi-camera] Flip chip: 0.6 x 0.6 mm to 18 x 18 mm Bump diameter 60 μm or more Bump pitch 110 μm or more, H 0.7 mm or less
SMD chip: 0402 (metric) to 20 x 20 mm, H 6 mm or less
Power supply 3-phase AC 200/208/220/240/380/400 / 416V +/- 10% 50 / 60Hz
Air supply source 0.5 MPa or more, clean/dry

Externe Dimension


** ohne Vorsprünge
L 1400 x B 1.820 x H 1515 mm (nur Hauptgerät)
L 1400 x B 2035 x H 1515 mm (wenn YWF Waferversorgungseinheit installiert ist)
Weight Approx. 2780 kg (when YWF wafer supply unit is installed)
* Specifications and appearance are subject to change without prior notice.