Laser Depaneling machine: Best cutting quality and outstanding performance
Our laser panel separators for printed circuit boards set new standards in precision, flexibility, and cleanliness.
State-of-the-art laser technology enables contactless, low-particle, and completely stress-free separation of printed circuit boards—ideal for densely populated or complexly shaped assemblies.
Unlike mechanical milling, laser cutting does not cause any microcracks or cutting stresses. With cutting widths of less than 30 µm, the system achieves a quality that far exceeds that of conventional routers.

Versatility in materials and designs
Our systems support FR4, FPCB, rigid-flex, and hybrid PCBs equally well.
With a material thickness of up to 1.2 mm (for FR4) and the option of using different laser sources—UV, green, or IR—the system can be customized to your production requirements.
This allows both rigid and flexible printed circuit boards to be separated precisely, without warping and without tools – ideal for sensitive assemblies in high-tech applications.
Highest cutting quality thanks to contactless process
Non-contact cutting minimizes particle formation and prevents mechanical damage or thermal overload.
An integrated smoke and particle extraction system keeps the process area clean and protects both printed circuit boards and optical components.
Result: Flawless cut edges, no burrs, no carbon residues—perfect for demanding applications in automotive, medical, or communications electronics.
Technological features at a glance
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Supports hybrid circuit boards (FPCB, rigid-flex PCB)
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Minimum cutting width: improved from 100 µm to less than 30 µm
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Use of different laser sources: UV, green, IR
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Clean process with particle and smoke removal
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Pin Table & Production Device for Stable Positioning
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Full-cut process – ideal for densely populated PCBs
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Materials: FR4, Kapton, FPCBs, ceramic circuit boards
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Thickness: up to 1.2 mm for FR4
Automation & Process Control
The integrated Beam Delivery System (BDS) ensures easy setup and automatic adjustment of laser power.
An optically optimized system guarantees precise beam guidance, while real-time monitoring of process parameters ensures consistently high quality.
Thanks to the fully graphical user interface, programming is intuitive and efficient, even for changing product layouts.
Optional extensions
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Hybrid cutting with drill and laser – maximum flexibility for materials
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Processing of aluminum and ceramic PCBs
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Inline laser milling for series production
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Fingerprint recognition system for process reliability
Cost efficiency thanks to double table system
An optional 2-table layout allows simultaneous loading and unloading during cutting.
This minimizes downtime, maximizes throughput, and significantly reduces the total cost per PCB.
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