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i-Cube10 YRH10

i-Cube10
i-Cube10

Yamaha i-Cube10 YRH10 hybrid placement machine

The Yamaha i-Cube10 YRH10 hybrid placement machine combines state-of-the-art technology for the mixed assembly of semiconductors and SMDs. This innovative solution from Yamaha ensures maximum precision, efficiency, and flexibility in electronics manufacturing.

Hybrid assembly of semiconductors and SMDs

The Yamaha i-Cube10 YRH10 hybrid placement machine enables the combined placement of different components—from semiconductors to SMDs—in a single process. The integrated post-assembly inspection function guarantees consistently high quality.

High-speed and high-precision assembly

With a 10-nozzle head, the machine achieves an impressive placement rate of up to 10,800 CPH (under optimal conditions) with an accuracy of ±15 μm (Cpk ≥ 1.0).
The inline head with integrated scan camera shortens the distances between pickup and placement, significantly increasing productivity.

The Multiple Accuracy Compensation System (MACS), developed by Yamaha, compensates for the slightest deviations and ensures consistent precision with every placement.

Yamaha i-Cube10

Yamaha i-Cube10

Intelligent feeding for greater efficiency

The i-Cube10 YRH10 is compatible with intelligent ZS feeders. These electrical feeding systems increase pick-up accuracy and facilitate handling.
The auto loading feeder allows two rolls to be preloaded, significantly reducing downtime and errors caused by missing components.

Yamaha i-Cube10

Expandable options

The machine offers numerous options such as nozzle stations for automatic nozzle replacement, blow-off stations, and other customizations.
With its ability to handle large PCBs up to L330 x W250 mm, it covers a wide range of applications.

Yamaha i-Cube10

Can be used for various production processes

Adaptable to different production layouts based on product types.
The highly productive, flexible placement machine helps to achieve highly efficient production processes.

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YSH20

The YAMAHA YSH20 is a high-speed flip chip hybrid placement machine with maximum precision. With a performance of 4,500 UPH (0.8 s/unit), it is ideal for flexible applications that go beyond simple flip chip placement.
The YAMAHA YSH20 has an outstanding mounting accuracy of +/- 10μm (3σ) (when using standard Yamaha components).
With YWF wafer supply unit for 6/8/12 inch wafers, “Expand Ring” and “θ angle correction” are applicable on the YSH20.

  • 4,500 UPH (0.8 sec/unit); upper mounting capability in flip-chip bonder
  • +/- 10 µm (3σ) Assembly accuracy
  • YWF Wafer Supply Unit “6/8/12 Inch,” “Extend Ring,” and “θ Angle Correction”
  • 0.6 x 0.6 mm to 18 × 18 mm components applicable


Approx. 2470 kg (main unit only)

Model YSH20

Applicable PCB
L 50 x w 30 mm to L 250 x w 200 mm
** “Bis zu L 340 x B 340 mm” anwendbar. Bitte kontaktieren Sie uns für weitere Details.
  • Assembly accuracy (for Yamaha standard components)
 [2F2F Heads & Multi-Camera Type]
Repeatability (3): +/- 0.010 mm / unit +/- 0.05 degrees
[4M4M Heads & Multi-Camera Type] ** Under development
Repeatability (3): +/- 0.010 mm / unit +/- 0.05 degrees
  • Assembly capability (under optimal conditions)
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** without dipping 3,600 UPH (1.0 sec/unit) ** including dipping
[4M4M Heads & Multi-Camera Type] ** under development 5,500 UPH (0.65 sec/unit) ** without dipping 4,500 cards per hour (0.8 sec/unit) ** including dipping
Component supply configuration Wafer (6/8/12-inch flat ring), waffle tray, roll reel (8/12/16 mm width)
Applicable components [Multi-camera] Flip chip: 0.6 x 0.6 mm to 18 x 18 mm Bump diameter 60 μm or more Bump pitch 110 μm or more, H 0.7 mm or less
SMD chip: 0402 (metric) to 20 x 20 mm, H 6 mm or less
Power supply 3-phase AC 200/208/220/240/380/400 / 416V +/- 10% 50 / 60Hz
Air supply source 0.5 MPa or more, clean/dry

Externe Dimension


** ohne Vorsprünge
 L 1400 x B 1.820 x H 1515 mm (nur Hauptgerät)
L 1400 x B 2035 x H 1515 mm (wenn YWF Waferversorgungseinheit installiert ist)
Weight Approx. 2780 kg (when YWF wafer supply unit is installed)
* Specifications and appearance are subject to change without prior notice.

 

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YSB55W

The YAMAHA YSB55W is a high-precision die attach bonder with up to three times the productivity of comparable systems available on the market!
With its speed, the YAMAHA YSB55W heralds a new era in semiconductor packaging for the expanding flip chip market.
High-speed 8-chip simultaneous pickup and simultaneous attachment at speeds of up to 13,000 UPH takes your output to unprecedented levels.
The YSB55W bonder has an outstanding placement accuracy of ± 5 μm at (3σ).

  • High bonding accuracy with up to 3* higher productivity compared to other commercially available systems
  • High-speed 8-piece picking and simultaneous transport, up to 13,000 UPH
  • High repeatability ±5 µm (3σ)
  • High quality and flexibility for the bonding process
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