ZM-R730A semi-automatic BGA soldering machine – precision for large printed circuit boards
The ZM-R730A semi-automatic BGA soldering machine is specially designed for reworking large printed circuit boards. It combines precise temperature control, HD optical alignment, and intelligent control in a robust and user-friendly machine. This soldering station is a powerful tool for electronics manufacturers who require the highest quality in BGA and SMD repairs. As one of the leading suppliers of rework stations, Zhuomao guarantees durable products and consistently precise results.
Stable temperature control for precise soldering
The ZM-R730A has three independently controllable temperature zones that are heated by convection hot air. The lower zone is height-adjustable, while the upper zone has an integrated vacuum suction nozzle. Negative pressure monitoring and pressure protection ensure maximum safety during the soldering process. This combination guarantees uniform heating and prevents thermal damage to sensitive components.
Large HD touchscreen and smart controls
The large HD touchscreen displays all processes in real time. Users can edit and analyze temperature curves and save up to 100 different profiles. The system uses a Panasonic PLC controller and a K-type thermocouple with an accuracy of ±1 °C. PID multi-loop control keeps the temperature constant throughout the entire process. An integrated over-temperature warning function and software encryption increase operational safety.
Removable infrared temperature zone for flexibility
The infrared preheating zone is heated by a carbon fiber IR tube and covered by a microcrystalline protective plate. It can be moved sideways to easily maintain large or irregular boards. This makes work much easier and increases the longevity of the system.
Optical HD alignment for precise placement
With a 2-megapixel HD imaging system and laser red dot indicator, the ZM-R730A ensures precise optical alignment. The alignment accuracy is an impressive ±0.01 mm. This feature guarantees error-free placement of even the smallest BGA components.
Technical data for the ZM-R730A soldering machine
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Power supply: AC380V ±10% 50/60 Hz
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Power: 7.75 kW (max.)
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PCB size: max. 632 × 520 mm
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BGA size: max. 80 × 80 mm
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Alignment accuracy: ±0.01 mm
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Display: 15″ HD industrial display
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Temperature sensors: 5 pieces
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Weight: 130.5 kg
Zhuomao – Quality and Innovation
Zhuomao is one of the most renowned manufacturers of BGA rework systems, offering machines designed for reliability, precision, and durability. The ZM-R730A semi-automatic BGA soldering machine combines technological innovation with ease of use—ideal for modern electronics repair and manufacturing.
Find out more about Zhuomao’s high-quality rework solutions on the official Seamark website.





