ZM-R730A semi-automatic BGA soldering machine

ZM-R730A semi-automatic BGA soldering machine – precision for large printed circuit boards

The ZM-R730A semi-automatic BGA soldering machine is specially designed for reworking large printed circuit boards. It combines precise temperature control, HD optical alignment, and intelligent control in a robust and user-friendly machine. This soldering station is a powerful tool for electronics manufacturers who require the highest quality in BGA and SMD repairs. As one of the leading suppliers of rework stations, Zhuomao guarantees durable products and consistently precise results.

Stable temperature control for precise soldering

The ZM-R730A has three independently controllable temperature zones that are heated by convection hot air. The lower zone is height-adjustable, while the upper zone has an integrated vacuum suction nozzle. Negative pressure monitoring and pressure protection ensure maximum safety during the soldering process. This combination guarantees uniform heating and prevents thermal damage to sensitive components.

Large HD touchscreen and smart controls

The large HD touchscreen displays all processes in real time. Users can edit and analyze temperature curves and save up to 100 different profiles. The system uses a Panasonic PLC controller and a K-type thermocouple with an accuracy of ±1 °C. PID multi-loop control keeps the temperature constant throughout the entire process. An integrated over-temperature warning function and software encryption increase operational safety.

Removable infrared temperature zone for flexibility

The infrared preheating zone is heated by a carbon fiber IR tube and covered by a microcrystalline protective plate. It can be moved sideways to easily maintain large or irregular boards. This makes work much easier and increases the longevity of the system.

Optical HD alignment for precise placement

With a 2-megapixel HD imaging system and laser red dot indicator, the ZM-R730A ensures precise optical alignment. The alignment accuracy is an impressive ±0.01 mm. This feature guarantees error-free placement of even the smallest BGA components.

Technical data for the ZM-R730A soldering machine

  • Power supply: AC380V ±10% 50/60 Hz

  • Power: 7.75 kW (max.)

  • PCB size: max. 632 × 520 mm

  • BGA size: max. 80 × 80 mm

  • Alignment accuracy: ±0.01 mm

  • Display: 15″ HD industrial display

  • Temperature sensors: 5 pieces

  • Weight: 130.5 kg

Zhuomao – Quality and Innovation

Zhuomao is one of the most renowned manufacturers of BGA rework systems, offering machines designed for reliability, precision, and durability. The ZM-R730A semi-automatic BGA soldering machine combines technological innovation with ease of use—ideal for modern electronics repair and manufacturing.

Find out more about Zhuomao’s high-quality rework solutions on the official Seamark website.

ZM-R7220A Infrared SMD Rework Station

ZM-R7220A Infrared SMD Rework Station – Intelligent technology for precise rework

The ZM-R7220A infrared SMD rework station is a modern and intelligent infrared soldering station with real-time temperature monitoring, an optical alignment system, and a fast heating and cooling function. Developed by Zhuomao, a leading manufacturer of rework systems, it offers maximum precision and reliability when working with sensitive BGA and SMD components. It is also attractively priced without compromising on quality or performance.

Real-time temperature monitoring for maximum control

The ZM-R7220A infrared SMD rework station monitors the temperature in real time. Temperature curves are automatically analyzed and displayed via the integrated 7-inch HD touchscreen. This provides the user with precise feedback throughout the soldering process and allows adjustments to be made immediately.

Optical HD alignment system for precise work

The integrated 2-megapixel CCD imaging system provides a clear and detailed display. Automatic optical zoom and laser red dot alignment enable components to be positioned precisely. The alignment accuracy is ±0.02 mm, which is particularly important for fine BGA components.

Fast heating and cooling with efficient IR technology

The IR preheating zone uses a medium-wave ceramic infrared heating plate with even heat distribution. A movable PCB holder and a BGA support frame enable flexible working. The integrated cooling system with laminar air flow ensures controlled and rapid cooling after the reflow process.

Technical specifications of the ZM-R7220A

  • Power supply: AC220V ±10% 50/60 Hz

  • Power: 5.65 kW (max.)

  • PCB size: max. 412 × 370 mm

  • Alignment accuracy: ±0.02 mm

  • Temperature accuracy: ±3 °C

  • Display: 15″ SD industrial display

  • Weight: 76 kg

  • Positioning: V-groove with universal mounting

Hot air vs. infrared – the key differences

The main difference between a hot air rework station and an infrared BGA rework station lies in the type of heating used.
Hot air systems use heated air to heat the solder joints. Infrared systems such as the ZM-R7220A use IR radiation to heat each solder joint specifically until the solder melts.

Another advantage of infrared technology is its more precise temperature control. While hot air stations are usually based on PID control, the ZM-R7220A uses a PPM (Proportional Pressure Modulation) system that detects and corrects pressure and temperature changes within milliseconds. This allows the system to react more quickly and prevents thermal damage to sensitive components.

There is also a difference in cooling: IR systems do not require a strong air flow, as cooling is achieved through controlled air circulation within the system – ideal for consistent results without deformation of the circuit board.

Zhuomao – Quality and Innovation

Zhuomao has been synonymous with high-quality rework technologies for years. The ZM-R7220A infrared SMD rework station combines efficiency, precision, and user-friendliness. Thanks to innovative sensor technology, fast heat transfer, and optical control, it is ideal for repairing modern electronics.

You can find out more about Zhuomao’s rework systems on the official Seamark ZM website.

R7830A Laser BGA SMD Rework Station

R7830A Laser BGA SMD Rework Station – Automatic precision for modern electronics

The R7830A Laser BGA SMD Rework Station is a sophisticated solution for precise rework of modern printed circuit boards. This device combines laser technology, optical alignment, and automatic control to ensure maximum efficiency in the repair and assembly of SMD and BGA components. Seamark ZM is one of the leading manufacturers of such systems and, with the R7830A, offers a model that perfectly combines quality and innovation.

Precise optical alignment and simple control

The R7830A features an imported HD CCD camera system with two million pixels, ensuring precise optical alignment. The joystick-controlled X/Y/Z axis system allows the operator to position components quickly and accurately. Operation is easy and convenient thanks to the multilingual menu and 8-inch HD touch panel.

Automatic X/Y/Z axis movement and vacuum adsorption

The system operates with automatic movement in all three axes. The upper heating head is equipped with a vacuum suction nozzle and a 360-degree rotation function, allowing chips to be placed precisely. The device also offers nitrogen protection, which prevents circuit boards from yellowing during the soldering process.

Intelligent temperature control for maximum quality

Technical highlights of the R7830A Rework Station

  • Power supply: AC380V ± 10%, 50/60 Hz

  • Power: 7.15 kW (max.)

  • PCB size: max. 565 × 467 mm

  • Alignment accuracy: ±0.01 mm

  • Display: 15″ HD industrial display (1080p)

  • Temperature sensors: 5 pieces

  • Dimensions: L810 × W1100 × H960 mm

  • Weight: 151 kg

Quality of Seamark ZM

Seamark ZM stands for durability and technical precision. The R7830A Rework Station was developed to meet the demands of challenging manufacturing and repair processes. Thanks to its combination of automatic alignment, precise temperature control, and ease of use, it is ideal for electronics manufacturers and repair shops.

Further information about modern rework systems can be found on the official Seamark ZM website.

ZEVAC ONYX 25 selective soldering machine with powerful heating, vision system, and precise automation. Precise soldering and repair system.

 

TECHNICAL DESIGN

The ONYX series, which has won design awards, combines a stable, innovative design in terms of both handling and construction. The ONYX 25 selective soldering machine is designed to securely hold oversized printed circuit boards.

CIRCUIT BOARD PREHEATER

The preheater has a standard output of 3500 W with a surface area of 300×300 mm, which can be increased to 7000 W with a surface area of 600×300 mm using an additional preheater module. With this level of performance, the necessary temperature profile for excellent lead-free soldering results can be defined, even for oversized PCBs.

ONYX 25 MAIN FEATURES

  • AXIS CONTROL
    4 motorized axes, controlled in a closed control loop
  • DESIGNED FOR EXTRA-LARGE PCBs,
    for PCBs up to 520 mm wide, with no restriction in length thanks to the open design
  • HIGH-PERFORMANCE TOP AND BOTTOM HEATING
    < 0 >2000 W top heating; 3500 W 300x300mm per preheater module (max. 2)
  • UP TO 8 THERMOCOUPLE INPUTS
    < 0 >for monitoring the process temperature
  • AUTOMATIC RESIDUAL SOLDER REMOVAL
    Option for removing residual solder from the solder joint after desoldering a component
  • FLOW CONTROL IN THE CLOSED CONTROL LOOP
  • STANDARD ZEVAC GAS NOZZLES
  • PRINTED CIRCUIT BOARD HOLDER
    For holding even irregularly shaped printed circuit boards without the need for additional fixing
  • FORCE MEASUREMENT,
    Force measurement in closed loop for automatic pick-up, fluxing, placement and desoldering.
  • VISION
    The new MFOV VISION system allows a complete view of components up to a size of 75x75mm, and the light intensity of the LED illumination can be adjusted.

 

RESIDUAL SOLDER REMOVAL
The residual solder removal option removes residual solder after desoldering a component without touching and damaging the surface of the printed circuit board. The land area is cleaned and prepared for soldering a new component after flux and solder paste have been applied. MOVABLE SOLDERING HEAD
The combination of the open machine design and the movable soldering head allows free positioning in the X-axis without having to move the circuit board. As the PCB remains in position, precise positioning of the component is guaranteed. For quick positioning above the work area. VISION SYSTEM
The advanced MFOV VISION system is included as standard with all selective soldering machines in the ONYX series. It allows a complete view of components up to a size of 75 x 75 mm, but also of small components with an edge length of 0.3 mm. FORCE MEASUREMENT
Force measurement is also standard on all selective soldering machines in the ONYX series. During placement, it protects sensitive components with a preselected contact force. REPEATABLE AND PRECISE AUTOMATION
The in-house developed VISUAL MACHINES™ machine software is the basis for fast and flexible profile creation. The profiles stored in the library and the performance features of the machine guarantee repeatable, precise selective soldering results.

LEAD-FREE APPLICATIONS
All ONYX devices from ZEVAC are supplied with a nitrogen connection as standard. This and the powerful top heating of 2000W and preheating of 3500W (7000W) provide the basis for reliable soldering results, even with lead-free operation.

For more information on the ONYX series, please visit the official ZEVAC website.