solder paste inspection

Solder paste inspection (SPI) is a key step in SMT manufacturing to ensure the highest soldering quality and process reliability. Even the smallest deviations in solder paste application can lead to inadequate solder joints, short circuits or failures – and thus compromise the overall product quality. Yamaha’s SPI systems provide you with a reliable solution for precise 3D measurement of solder paste volume, height, area and position immediately after the printing process.

Our systems combine high-resolution 3D sensor technology with fast data evaluation and intuitive software. This allows you to detect printing errors in real time and initiate immediate corrective measures. The result: stable printing processes, lower scrap rates and consistently reproducible solder joints – even with high-density components and fine-pitch layouts.

Neutec’s solder paste inspection systems can be seamlessly integrated into existing SMT lines and are optimally tailored to the modern requirements of electronics manufacturing. They form the basis for an error-free production process and provide precise data for long-term optimised process control.