The X7600 offline X-ray machine uses the world-leading Japanese Hamamatsu X-ray source, which is renowned for its exceptional image quality, long service life, and high operational reliability. By integrating this high-quality source, the system achieves impressive precision in defect detection and enables reliable, detailed imaging of even the smallest internal structures of electronic components. This makes the device an indispensable tool in modern electronics manufacturing and in the quality assurance of demanding production processes.
The X7600 industrial X-ray machine is specially designed to quickly and accurately identify critical defects in semiconductor packaging. This includes detecting defects such as bent gold wires, broken wire connections, or insufficiently bonded contacts, which often only become visible under high magnification or using special X-ray techniques. With its powerful X-ray technology, the system can reliably evaluate even complex bonding processes and provides a clear basis for quality decisions and process optimization.
A particular advantage of the X7600 is its extremely large work platform, which enables the loading and testing of large-format electronic assemblies. This means that not only standard circuit boards but also very large industrial control motherboards or exceptionally long electronic components can be analyzed. Typical examples include long LED light strips, multilayer circuit boards, or specially manufactured assemblies for industrial applications. The system is therefore extremely flexible and ideal for production environments with a high degree of variety.
Thanks to its robust construction, intuitive user interface, and versatile settings, the device can be easily integrated into existing production processes. The controls are designed so that even users without in-depth X-ray knowledge can use the machine efficiently. Automatic inspection programs, freely definable inspection profiles, and comprehensive analysis tools help to standardize inspection procedures while speeding up evaluation.
The X7600 is used in a wide range of areas in the electronics industry – from semiconductor manufacturing and LED technology production to the construction of complex control and communication systems. Whether in research and development, series production, or end-of-line quality control, the device delivers consistently high image quality and enables reliable, non-destructive inspection of electronic components. It thus makes a decisive contribution to increasing product quality, reducing error rates, and boosting the efficiency of the entire manufacturing process.
Merkmale des X7600 Offline-Röntgengerät
– Electronics manufacturing/semiconductors/photovoltaics/connectors/LED, etc.
– High-resolution inspection image: Offset/bonded tin/blase/cold solder/solder wire.
– 130KV 5μm closed X-ray tube, long service life, maintenance-free.
– 2.3 million high-resolution digital flat panel detector.
– 5 AXI X-ray linking system.
– Observation at 60 degrees.
– 360-degree rotation of the platform.
– Color image navigation.
-Supports image stitching function (optional).
Upgradeable 3D module (industrial CT) (optional).
Automatic test plan adjustment (optional).
Specifications of the X7600 offline X-ray machine
X-ray tube source specifications
• Type: Sealed microfocus X-ray tube
• Voltage: 90 kV (130 kV optional)
• Operating voltage range: 40-90KV/130KV
• Operating current range: 10-200 μA/300μA
• Maximum output power: 8 W/39W
• Microfocus spot size: 5-15μm
Flat Panel Detector Specifications
• Type: CMOS flat panel detector
• Pixel Matrix: 1172×1100
• Field of View: 58mm×54mm
• Resolution: 10.1Lp/mm
• Frame Rate: (1×1) 30fps
• A/D Conversion Bit: 14bits
• Dimensions: L1700mm×W1770mm×H1800mm
• Input power: 220V 10A/110V 15A 50-60Hz
• Maximum sample size: 500mm×500mm
• Control: Industrial PC WIN7/ WIN10 64bits
• Net weight: approx. 1900KG
• Radiation: ＜1μSv/h
• Max tilt angle: 65 degrees
