X7600 inspection machine adopts the world’s leading Japanese Hamamatsu X-ray source. This industrial X-Ray machine can easily distinguish the semiconductor package gold wire bending, gold wire breaking, super large platform can load super large industrial control motherboard, super long LED light bar, suitable for various fields electronic products.
Features of the X7600 offline X-ray inspection device
– Electronics manufacturing/semiconductors/photovoltaics/connectors/LED, etc.
– High-resolution inspection image: Offset/bonded tin/blase/cold solder/solder wire.
– 130KV 5μm closed X-ray tube, long service life, maintenance-free.
– 2.3 million high-resolution digital flat panel detector.
– 5 AXI X-ray linking system.
– Observation at 60 degrees.
– 360-degree rotation of the platform.
– Color image navigation.
-Supports image stitching function (optional).
Upgradeable 3D module (industrial CT) (optional).
Automatic test plan adjustment (optional).
Specification of the X7600 offline X-ray inspection machine
X-ray tube source specification
– Type: Sealed microfocus X-ray tube
– Voltage: 90 KV (130KV optional)
– Operating voltage range: 40-90KV/130KV
– Operating current range: 10-200 μA/300μA
– Maximum output power: 8 W/39W
– Microfocus point size: 5-15μm
Flat screen detector specification
– Type: CMOS flat panel detector
– Pixel matrix: 1172×1100
– Field of vision: 58mm×54mm
– Resolution: 10.1Lp/mm
– Picture: (1×1) 30fps
– A/D conversion bit: 14bits
– Dimensions: L1700mm×W1770mm×H1800mm
– Input power: 220V 10A/110V 15A 50-60HZ
– Maximum sample size: 500mm×500mm
– Control: Industrial PC WIN7/ WIN10 64bits
– Net weight: approx. 1900KG
– Radiation: ＜1μSv/h
– Max tilt angle: 65 degrees
