The YAMAHA YSB55W is a high-precision die attach bonder with up to three times the productivity of comparable systems available on the market!
With its speed, the YAMAHA YSB55W heralds a new era in semiconductor packaging for the expanding flip chip market.
High-speed 8-chip simultaneous pickup and simultaneous attachment at speeds of up to 13,000 UPH takes your output to unprecedented levels.
The YSB55W bonder has an outstanding placement accuracy of ± 5 μm at (3σ).
- High bonding accuracy with up to 3* higher productivity compared to other commercially available systems
- High-speed 8-piece picking and simultaneous transport, up to 13,000 UPH
- High repeatability ±5 µm (3σ)
- High quality and flexibility for the bonding process
