The YAMAHA YSP10 is a fully automatic high-speed solder paste printer with the capacity for ultra-small chips up to 0201 metric.
Optionally, stencils and solder paste can be automatically fed through the machine during the changeover. The automatic pen placement option and 2D inspection help you to ensure a stable printing process at all times
The YSP10 solder paste printer features YAMAHA’s patented 3S single-swing squeegee, which allows the solder paste filling level to be perfectly adjusted for each product by means of an individually adjustable squeegee angle.
Automatic detection of the remaining amount of solder paste,
visual customisation and stencil vacuum and many other helpful options, nothing stands in the way of your perfect print result.
The Yamaha YSP10 specifically complements our portfolio and enables us to offer our customers a one-stop shop in the form of our Total Line Solution.
- Zykluszeiten auf höchstem Niveau weltweit
- Offers fully automatic stencil change
- Very high and precise print quality
- Supports extra large boards and large format stencils
| model | YSP10 |
| Applicable PCB | L 510 x W 510 mm to L 50 x W 50 mm |
| Printhead | 3S head (3S swing single squeegee) |
| Printing accuracy | Repeatability (6σ): +/- 0.010 mm |
| Cycle time | s, (standard printing: under optimal conditions, including board transfer time and printing time) |
| Applicable sieve size | L 750 x W 750 mm |
| Power supply | Single-phase alternating current 200/208/220/230 V +/- 20 V |
| Air supply source | 0.45 MPa or more, clean / dry |
| External dimension | L 1,640 x W 1,990 x H 1,525 mm (all options) |
| To weigh | Approx. 1,700 kg |