Yamaha Robotics SMT Section has introduced its latest VP-01G-Y inline solder paste inspection system to increase quality and productivity in surface mount assembly.


The VP-01G-Y combines high-speed and high-resolution inspection functions in a single device and uses state-of-the-art algorithms in 2D and 3D mode to support focusing and contour extraction. The analysis includes 3D solder paste and adhesive inspection, foreign object detection and PCB warpage measurement to support stencil printing, dispensing and component assembly processes. The system compensates for PCB warping and enables the inspection of flexible PCBs. Device features include a ring light source that provides 360° illumination to ensure reliable inspection and accurate three-dimensional measurements.

The single-head design enables continuous, changeover-free inspection with 25 µm, 20 µm or 15 µm objective and software-controlled multi-resolution switching for further settings. The resolution is switchable for each image field and enables optimum throughput when inspecting PCBs with a high component density and components of different sizes, including tiny components up to 0201 and 03015 chips.

The VP-01G-Y system has been designed to be fully integrated with the 1 STOP SMART SOLUTION for surface mounting and the YSUP intelligent factory software, enabling comprehensive data exchange with upstream and downstream devices. The system automatically responds to setup change instructions according to board identity, reports back inspection results to improve print quality, and relays badmark data to minimize component assembly cycle time.

The VP-01G-Y adds powerful and data-driven functions to surface mounting, with a space-saving footprint of just 938 mm x 1191 mm. The spectrum of possible PCB formats, ranging from 50 mm x 50 mm to 510 mm x 510 mm, meets the production requirements of a wide range of industries, such as automotive, medical, industrial and consumer electronics manufacturing.

Link to the brochure

 

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