X7600 inspection machine adopts the world’s leading Japanese Hamamatsu X-ray source. This industrial X-Ray machine can easily distinguish the semiconductor package gold wire bending, gold wire breaking, super large platform can load super large industrial control motherboard, super long LED light bar, suitable for various fields electronic products.


Features of the X7600 offline X-ray inspection device

 

– Electronics manufacturing/semiconductors/photovoltaics/connectors/LED, etc.

– High-resolution inspection image: Offset/bonded tin/blase/cold solder/solder wire.

– 130KV 5μm closed X-ray tube, long service life, maintenance-free.

– 2.3 million high-resolution digital flat panel detector.

– 5 AXI X-ray linking system.

– Observation at 60 degrees.

– 360-degree rotation of the platform.

– Color image navigation.

-Supports image stitching function (optional).
Upgradeable 3D module (industrial CT) (optional).
Automatic test plan adjustment (optional).


Specification of the X7600 offline X-ray inspection machine

 

X-ray tube source specification
– Type: Sealed microfocus X-ray tube
– Voltage: 90 KV (130KV optional)
– Operating voltage range: 40-90KV/130KV
– Operating current range: 10-200 μA/300μA
– Maximum output power: 8 W/39W
– Microfocus point size: 5-15μm


Flat screen detector specification
– Type: CMOS flat panel detector
– Pixel matrix: 1172×1100
– Field of vision: 58mm×54mm
– Resolution: 10.1Lp/mm
– Picture: (1×1) 30fps
– A/D conversion bit: 14bits


– Dimensions: L1700mm×W1770mm×H1800mm
– Input power: 220V 10A/110V 15A 50-60HZ
– Maximum sample size: 500mm×500mm
– Control: Industrial PC WIN7/ WIN10 64bits
– Net weight: approx. 1900KG
– Radiation: <1μSv/h
– Max tilt angle: 65 degrees

The X6600 is a cost-effective, universally applicable offline precision microfocus X-ray inspection device. It is suitable for the inspection of various offline products in the factory. This AXI inspection machine has the features of high magnification, multi-angle inspection and a large-area inspection platform.


Features of the X6600 offline X-ray inspection device

 

– Meets the requirements of general industrial X-ray equipment and offers a wide range of applications.

– A high-resolution design can get the best image in a very short time.

– Infrared automatic navigation and positioning, quickly select the recording position.

– CNC detection mode, fast automatic detection for multi-point array.

– Oblique multi-angle inspection makes it easier to detect sample defects.

– The software developed by Seamark is simple and easy to use and has low operating costs.

– The X-ray tube and the FDP can be rotated simultaneously (0-60°), making the detection image clearer and more intuitive.


Specification of the X6600 offline X-ray inspection machine

 

X-ray tube source specification

– Type: Sealed microfocus X-ray tube
– Voltage: 90 KV/130KV
– Operating voltage range: 40-90KV/130KV
– Operating current range: 10-200 μA/300μA
– Maximum output power: 8 W/39W
– Microfocus point size: 5-15μm


Flat screen detector specification

– Type: TFT Industrial dynamic FPD
– Pixel matrix: 1536×1536
– Field of vision: 130mm×130mm
– Resolution: 5.8Lp/mm
– Picture: (1×1) 20fps
– A/D conversion bit: 16bits


Dimensions: L1360mm×W1240mm×H1700mm
Input power: 220V 10A/110V 15A 50-60HZ
Maximum sample size: 540 mm×440mm
Control: Industrial PC WIN7/ WIN10 64bits
Net weight: approx. 1170KG
Radiation:<1μSv/h
Max tilt angle: 65 degrees

 

The X5600 is a small, precise microfocus X-ray inspection device suitable for R&D companies, laboratories, quality control rooms, etc. It is the first choice for X-ray inspection devices for small parts. The IC chip X-ray inspection machine is a device for non-destructive testing, in particular for the prospective inspection of internal defects in IC chips. It is one of the best methods for detecting defects in IC chips. The X-ray inspection device mainly relies on the internal X-ray tube, which emits X-rays to irradiate the IC chip for imaging. Once the X-rays have penetrated the object, the digital tablet receives the image signal and transmits it to the computer. After software processing, the image is displayed on the screen in real time. X-ray testing belongs to the category of non-destructive testing of IC chips. The tested samples can be reused, effectively reducing production and testing costs.


Functions of the Seamark X5600 offline X-ray inspection device

 

Automatic void ratio calculation

Improved BGA test function

The X5600 industrial X-ray inspection machine can quickly select and mark individual solder balls or select the solder balls to be inspected by matrix box; it can manually or automatically identify BGA solder balls and complete the inspection. Follow the system guidelines to make the inspection process easy and ensure accurate and reliable inspection results.

 


Size measurement

Measuring tools

Distance, distance ratio, line distance, angle, arrow mark, circle radius, point distance, circle center distance, circumference, hand-drawn polygon, hand-drawn freeform, etc. can add a text description.

 


Defect inspection

Detect defects automatically

The X5600 can automatically detect size, area, wire breakage, bridging, etc.

Customizable image algorithm

Customized software algorithms based on product features and requirements for fully automated defect inspection algorithms, including Y/N, crack, wire break, offset size and quantity, etc.


CNC inspection

Automatic CNC operational check

The X5600 supports the automatic CNC multi-point inspection mode, which is based on the product feature of multi-point coordinates for automatic inspection.

Automatic CNC operation detection

Automatically save images, create reports, also supports batch inspection.


Tilt/rotate function

Function for checking the tilt angle

The X5600 detector manufactured by Zhuomao supports a tilt angle of ±30°. In cases where the photo taken on the front of a specific device cannot identify the defective feature, the tilt function can be used to view the features of the device from multiple angles, making it easier to analyze and identify the defect.

360° rotating photo inspection function

Equipped with a rotating manipulator that can rotate 360 degrees to capture images, there is no blind spot for defect observation.


Advantages of the Seamark X5600 offline X-ray inspection device

 

– Miniaturized equipment, easy to install and operate.

– Applicable for chip, LED, BGA/CSP, wafer, SOP/QFN, SMT and PTU packaging, sensors, connectors and precision casting inspection.

– High-resolution design to get the best image in a very short time.

– Automatic infrared navigation and positioning function for quick selection of the recording location.

– CNC inspection mode for fast and automatic inspection of multi-point fields.

– The inclined multi-angle inspection facilitates the inspection of sample defects.

– Simple software operation, low operating costs.

– Long service life.


Drawing of the Seamark X5600 offline X-ray inspection machine

 


Specifications of the Seamark X5600 offline X-ray inspection machine

 

X-ray tube source specification
– Type: Sealed microfocus X-ray tube
– Voltage range: 40-90KV
– Current range: 10-200 μA
– Maximum output power: 8 W
– Microfocus point size: 15μm

Flat screen detector specification
– Type: TFT Industrial dynamic FPD
– Pixel-Matrix: 768×768
– Field of vision: 65mm×65mm
– Resolution: 5.8Lp/mm
– Picture: (1×1) 40fps
– A/D conversion bit: 16bits

– Dimensions: L850mm×W1000mm×H1700mm
– Input power: 220V 10A/110V 15A 50-60HZ
– Maximum sample size: 280mm×320mm
– Control system: Industrial PC WIN7/ WIN10 64bits
– Net weight: About 750KG


Safety aspects of the X5600 offline X-ray inspection machine

 

Obtaining an exemption from the Ministry of Ecology and Environment of the People’s Republic of China

The X5600 received the certification document (sixth batch) for the exemption license for radioisotope and radiation devices from the Ministry of Ecology and Environment with the entry number [Yuehuan [2018] No. 1688]. The radiation device with this product model of our company can be exempted from the radiation protection license.

Design of the safety guard

According to the “Basic Standards for Ionizing Radiation Protection and Safety of Radiation Sources” (GB18871-2002), the radiation protection exemption standard is ≤1uSv/h, the design standard of this product is ≤0.5uSv/h, which is 1/10 of the amount of radiation in the natural environment.

Components Multiple safety protection

Equipped with OMRON’s safety control element, triple safety protection sensor and direct connection control with the radiation source, it fully complies with CE specifications and the semiconductor industry’s SEMI S2/S8 specifications.