SPEA 3030 Compact – Kleine Standfläche, hohe Fehlerabdeckung

Highlights

1. 2-fold parallel test
2. Low space requirement
3. Parametric high-speed ICT
4. Automatic application development
5. Wide range of test methods: ICT, FKT, flashing

Compact. Powerful.

The SPEA 3030 Compact is designed for fast and cost-effective in-circuit testing. With a small footprint, it offers maximum testing possibilities. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput of conventional ICT testers with 100% fault coverage.

Parallel tests

The SPEA 3030 Compact can be configured as a multi-core system with up to 2 independent cores – each with independent CPU, local memory and instrumentation.

Reduce testing costs

The multi-core architecture drastically reduces testing costs. You only need one tester, one handling procedure, one adapter and one PC to test two assemblies simultaneously.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Compact was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Compact reliably finds faults that cannot be detected by conventional ICT testers.

Parallel flashing of several components

The SPEA 3030 Compact can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The assembly is contacted securely and precisely. With the SPEA electromechanical drawer receiver, the contact pressure speed can be adjusted to suit the specific test piece.
The lowering process is always completely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Compact checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Test performance of the SPEA 3030 Compact

• True-Per-Pin Architecture
  SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
• Open pin detection
  Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process errors: Electro Scan and Junction Scan.
• Function test
  The SPEA 3030 Compact offers function tests not only at the component level, but also at the cluster and board levels. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
• Customizable & flexibly retrofittable
  The uncompromising flexibility of our testers ensures individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
  The wide range of adaptation options is outstanding, including drawer receivers, plug interfaces, inline contact units, pylon interfaces, as well as customer-specific interfaces or receivers from third-party providers (Genrad, Ingun, Zentel, etc.).
• Boundary scan
  Boundary scan is used when physical access to individual circuit components is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact enables broader fault coverage while reducing adapter costs (virtual test points instead of real test probes).
  Transfer of test programs and adapters to other testers
  SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

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SPEA 3030BT – Testing has never been easier

SPEA 3030BT In-Circuit Tester – compact, precise, powerful

The SPEA 3030BT In-Circuit Tester is a compact and cost-effective tester for precise electronics testing. Despite its small footprint, it offers the full performance of the SPEA 3030 series. With modern technology, simple operation, and flexible integration, the tester is the ideal solution for manufacturing environments with limited space and high quality requirements.

Simple testing with maximum efficiency

Testing has never been easier than with the SPEA 3030BT in-circuit tester. The user-friendly Leonardo system software enables automatic test program creation and fast debugging. In just a few steps, the software guides the user from data import to a stable test program. The system can be connected to a PC or notebook via USB and used immediately—uncomplicated, efficient, and reliable.

High testing performance in the smallest of spaces

The SPEA 3030BT in-circuit tester requires minimal space and can be used both as a benchtop device and in a standard 19″ rack. Its ergonomic design with front handles facilitates transport and makes it the perfect solution for flexible production environments. Despite its compact size, the tester operates with the same powerful hardware modules as larger systems in the SPEA 3030 series.

PC-independent architecture for stable performance

The internal CPU of the 3030BT in-circuit tester ensures that the test program runs independently of the PC. This keeps the test speed constant—even if the connected computer is executing other processes or is replaced. This architecture increases operational reliability and minimizes downtime in the production process.

Reliable error detection and test coverage

The SPEA 3030BT in-circuit tester offers comprehensive testing capabilities, including:

• In-circuit testing for short circuits, open pins, and faulty components
• Open pin detection through Electro Scan and Junction Scan
• True per-pin architecture with 1:1 independent measurement channels
• 16-bit instrumentation and 8-wire measurements for maximum accuracy

These technologies enable precise identification of process errors that are often overlooked by conventional ICT testers.

Modularity and future-proofing

Thanks to its modular architecture, the SPEA 3030BT in-circuit tester can be flexibly adapted to individual requirements. Manufacturers benefit from a durable test solution that can be easily expanded and modernized—an investment that pays off in the long term.

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