SPEA T300

In-circuit tester with highest parallelism

32-fold parallel test

The SPEA T300 board tester has a unique tester architecture with up to 32 parallel incircuit test cores and additional capacity of 256 cores for flashing and functional testing. The asynchronous parallel architecture of the SPEA T300 allows testing and parallel flashing of up to 32 PCBAs (Printed Circuit Board Assembly).

The SPEA T300 Needlebed Tester offers SPEA’s unique ICT-Plus technology, which finds electronic faults that are not detected by conventional ICT tests.

Test and flash a variety of assemblies in parallel

Many assemblies are manufactured in the panel, i.e. a few to a large number of assemblies are connected in the panel assembly to form a large printed circuit board. Each of these individual assemblies in turn contains a few to countless components and parts that must be tested and programmed.

SPEA’s new T300 board tester is specifically designed for user testing, or testing and programming many boards at once. It thus guarantees the highest throughput and the lowest testing and programming costs.

 

 

Programmable as single or dual test station

The SPEA T300 can be programmed as a single or dual test station.

In Single Test Site mode, a single board can be ICT and function tested and flashed.

Dual Test Side enables the simultaneous testing of two boards. This applies to ICT, flash programming and functional testing. To double the throughput, the tester can perform a split test. At Station 1, for example, an ICT is performed while at Station 2 either flashing or a functional test is performed simultaneously.

Operatorless testing

The SPEA T300 can be configured in several automated operating modes that operate unattended

  • Inline loading – Inline unloading
  • Loading from rack – inline unloading [1]
  • Inline loading – unloading in rack [1] [2].
  • Loading from rack – unloading into rack [1] [2].

[1] Option: Rack loading by robot
[2] Option: Pass – Fail – Sort

In-circuit tester – connected to the digital ecosystem

The SPEA T300 interacts with the Industrie 4.0 environment and digital ecosystem – in terms of information, notifications, programming commands and machine instructions.

The tester has sensors to detect and observe the environment, wear parts and moving parts, electrical and pneumatic power supplies, and internal and external power supplies. This enables him to:

  • Support for predictive maintenance
  • Error detection in advance, which would lead to malfunctions
  • Estimation of wear and remaining service life of machine parts

The SPEA T300 is designed for continuous and intensive use even in harsh manufacturing environments. Easy to maintain – maintenance can be performed easily and quickly.

ATOS Leonardo 4 ICT is the T300 version of the ATOS system software developed by SPEA for its testers.

ATOS contains all the operating and programming functions needed for the tester. This makes you independent of the Windows® version and the configuration and performance of the system PC.

 

 

 

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SPEA 3030IL In-Circuit Tester

4-fold parallel test, ultra-fast handling.
No operator required. Minimal testing costs.

Highlights

  1. 4x throughput with quad-core architecture
  2. No costs for operating personnel
  3. Ultra-fast handling in 3 seconds
  4. 5000+ tests/sec.
  5. Automatic test program generation
  6. Parallel programming of ICs of different types

High Volume. High quality.
Low test costs.

The SPEA 3030 Inline is optimized for use in automated production environments. It can be easily integrated into SMEMA production lines or combined with standard automatic loading and unloading systems. The system has a modular design and can be configured according to customer requirements. In addition to the in-circuit test, the SPEA 3030 Inline also performs digital tests and tests power electronics assemblies.

Quad-core for parallel tests

The SPEA 3030 Inline can be configured as a multi-core system with up to 4 independent cores – each with independent CPU, local memory and instrumentation. This allows up to 4 assemblies to be tested simultaneously. The throughput of the SPEA 3030 Inline is thus up to 400% higher, which minimizes test costs.

Ultra-fast handling

The SPEA 3030 Inline is equipped with a redesigned handling module that halves the handling time compared to the previous model. 3 seconds are enough to handle a medium-sized assembly – including loading, pressing on and releasing the adapter and final unloading.

Adapter and test program are compatible with the manually operated variants of the system family

The SPEA 3030 Inline is fully compatible with systems that are operated manually. You can switch from an inline tester to a manual tester and vice versa. This means that debugging can be carried out on a manual system and the inline system can continue to be used in production.

Maximum throughput thanks to multi-stage

Using the multi-stage option, the SPEA 3030 Inline can perform various test procedures simultaneously (e.g.: in-circuit + function test, in-circuit + flashing, etc.). This optimizes the test time and reduces costs.

No operating personnel

The SPEA 3030 Inline does not require any operating personnel. The system works fully automatically in inline production or with loaders and unloaders. It is controlled via SMEMA or HERMES. This increases throughput and drastically reduces testing costs.

Highest test speed

Compared to conventional needle bed testers, the test speed of the SPEA 3030 is significantly higher. A dedicated CPU in each core guarantees delay-free communication between instruments and PC. High-performance relays ensure fast switching times. The system architecture minimizes the setup of the instruments. It is also possible to carry out different measurements simultaneously with a single core.

Controlled contacting with motorized receiver

The electromechanical contacting unit is integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation, and signal integrity is guaranteed. The test system and adaptation were developed by SPEA as a reliable and cost-effective turnkey test solution. The contacting of the assembly is safe and precise. The contact pressure speed of the receiver can be set specifically for the test specimen. The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parallel flashing of several components

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Parametric ICT at maximum speed

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

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SPEA 3030M In-Circuit Tester

Complete fault coverage
High throughput. High scalability.

Highlights

  1. Parallel tests reduce test costs
  2. Multifunction: complete fault coverage
  3. Customizable & flexibly retrofittable
  4. Testing power electronics with the SPEA power modules
  5. Automatic test program creation
  6. Parallel programming of ICs of different types

Multifunctional test options:
100 % coverage with just 1 system.

The SPEA 3030 Multimode is a multifunctional, modular test system that can be configured to customer specifications. It offers complete fault coverage in combination with minimized test costs.

SAVE MONEY – Why buy several testers when you only need one? All tests can be carried out with the SPEA 3030 Inline: Incircuit, cluster and function test, as well as on-board programming and boundary scan. Compared to several test stations, the advantages are enormous: no additional operating personnel, a single test program, reduced floor space and lower operating costs.

SAVE TIME – Drastically reduce testing time with the SPEA 3030 Inline.
The SPEA-specific system architecture with special processors enables different test sequences to be carried out. Redundancies, time-consuming handling and testing of assemblies at several test stations are eliminated. The assemblies pass through the SPEA 3030 Inline once and are tested completely and efficiently.

REDUCING FIELD PRESSURE RUNS – The SPEA 3030 was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 reliably finds faults that cannot be detected by conventional ICT testers.

Quad-core for parallel tests

The SPEA 3030 Multimode can be equipped with up to 4 cores, each with independent CPU, local memory and instrumentation. This allows up to 4 assemblies to be tested in parallel. This reduces testing costs by up to 75% compared to standard ICT testers. You only need one tester, one handling procedure, one adapter and one PC to test four assemblies simultaneously.

Parallel flashing of several components

The SPEA 3030 Multimode can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.)

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The contacting of the assembly is safe and precise. With the electromechanical SPEA drawer receiver, the contact pressure speed can be set specifically for the test specimen.
The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Multimode was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Multimode reliably finds faults that cannot be detected by conventional ICT testers.

Testperformance

  • Boundary Scan
    Boundary Scan is used when physical access to individual circuit parts is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Multimode enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030 Multimode not only offers functional tests at component level, but also at cluster and board level. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • True-Per-Pin architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Parametric ICT at maximum speed
    The parametric-dynamic high-speed ICT of the SPEA 3030 Inline checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.
  • Transfer of test programs and adapters to other testers
    The SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

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SPEA 3030CE In-Circuit Tester

High throughput. High error coverage.
Fully compatible with the SPEA 3030 Inline.

Highlights

  1. 2-fold parallel test
  2. Contacting unit compatible with SPEA 3030 Inline
  3. Parametric high-speed ICT
  4. Automatic application development
  5. Diverse test methods

Fully compatible with the SPEA 3030 Inline

The SPEA 3030 Compact extended is a cost-effective needle bed tester with manual handling that is compatible with the SPEA 3030 Inline. The adapter, pressure unit and test program can be quickly and easily ported from the SPEA 3030 CE to the inline tester – and vice versa. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput. It offers a wide range of test procedures and test options as well as 100% fault coverage.

Parallel tests

The SPEA 3030 Compact extended can be equipped with up to 2 cores, each with independent CPU, local memory and instrumentation. This allows up to 2 assemblies to be tested in parallel.

Transfer of adapters and test programs to the SPEA 3030 Inline

The contacting and pressure unit and test program are fully compatible with the SPEA 3030 Inline. You can quickly and easily switch your production from a system with manual operation to a fully automatic system and vice versa, depending on your production requirements.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Parallel flashing of several components

The SPEA 3030CE can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The contacting of the assembly is safe and precise. With the electromechanical SPEA drawer receiver, the contact pressure speed can be set specifically for the test specimen.
The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Inline checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Testperformance

  • True-Per-Pin architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030CE not only offers functional tests at component level, but also at cluster and board level. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • Customizable & flexibly retrofittable
    The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely at the
    Purchase or upgrade successively – anything is possible. Third-party measuring instruments can also be easily integrated. The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.).
  • Boundary Scan
    Boundary Scan is used when physical access to individual circuit parts is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact Extended enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).

Learn more >

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SPEA 3030C In-Circuit Tester

Small footprint, high fault coverage

Highlights

  1. 2-fold parallel test
  2. Low space requirement
  3. Parametric high-speed ICT
  4. Automatic application development
  5. Wide range of test methods: ICT, FKT, flashing

Compact. Powerful.

The SPEA 3030 Compact is designed for fast and cost-effective in-circuit testing. With a small footprint, it offers maximum testing possibilities. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput of conventional ICT testers with 100% fault coverage.

Parallel tests

The SPEA 3030 Compact can be configured as a multi-core system with up to 2 independent cores – each with independent CPU, local memory and instrumentation.

Reduce testing costs

The multi-core architecture drastically reduces testing costs. You only need one tester, one handling procedure, one adapter and one PC to test two assemblies simultaneously.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Compact was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Compact reliably finds faults that cannot be detected by conventional ICT testers.

Parallel flashing of several components

The SPEA 3030 Compact can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The contacting of the assembly is safe and precise. With the electromechanical SPEA drawer receiver, the contact pressure speed can be set specifically for the test specimen.
The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Compact checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Testperformance

  • True-Per-Pin architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030 Compact not only offers functional tests at component level, but also at cluster and board level. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • Customizable & flexibly retrofittable
    The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
    The wide range of adaptation options, such as drawer receivers, plug interfaces, inline contacting units, pylon interfaces and also customer-specific interfaces or third-party receivers (Genrad, Ingun, Zentel, etc.), are outstanding.
  • Boundary Scan
    Boundary Scan is used when physical access to individual circuit parts is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact enables broader fault coverage while at the same time reducing adapter costs (virtual test points instead of real test needles).
    Transfer of test programs and adapters to other testers
    The SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

Learn more >

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SPEA 3030R In-Circuit Tester

No additional space required. High throughput.

Highlights

  1. No additional space required
  2. Multifunctional test options
  3. Can be integrated into any production cell

Multi-core board tester without additional space requirement

Reduce the space required to zero with the SPEA 3030 Rack board tester. The tester can be easily integrated into existing automation solutions, third-party systems, existing contacting devices or a 19” housing via the connector interface.
The SPEA 3030 rack offers a wide range of testing capabilities and unparalleled throughput.

Highest accuracy and complete error coverage are guaranteed. Like all SPEA 3030 systems, it has 16-bit instrumentation and can be configured according to your requirements. It offers a wide range of test techniques integrated into a single test station.

After all, integration into third-party systems does more than just save space: common elements such as mechanics and frame construction are used, and the costs for testing are further reduced.

No additional space required: maximize space and resources

The SPEA 3030 Rack offers multifunctional testing without the need for additional space: the tester can be installed in a 19″ housing or integrated into your production line.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

As powerful as everyone in the tester family

As a member of the SPEA 3030 series, the SPEA 3030 Rack offers maximum performance and highest measurement accuracy without requiring additional space. In addition, the direct connection between the SPEA 3030 rack and third-party system interfaces guarantees signal integrity, avoiding losses and signal overlaps.

Easy to use: even without specialist knowledge

The SPEA 3030 Rack is easy to operate. The Leonardo system software enables rapid generation of the test program and simple debugging. The auto-debug and auto-tuning functions support this. This increases the measurement stability and shortens the test time.

Testperformance

  • Incircuit test (analog, digital, mixed)
  • Power-On-Test
  • Function test
  • Flashing via the on-board programming
  • Open Pin Scan
  • Boundary Scan
  • Built-In-Self-Test
  • Parametrische Tests

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SPEA 3030BT In-Circuit Tester

Testing has never been so easy

Highlights

  1. Cost-effective tester with a small footprint
  2. Fast in-circuit test and open pin scan
  3. Automatic test program creation
  4. USB connection to PC/notebook
  5. Reliably detects process errors

Performance has never been so affordable

The SPEA 3030 benchtop is an in-circuit tester with minimal space requirements. There is no need to compromise on test performance, as the tester is equipped with the powerful hardware modules of the SPEA 3030 series.

The SPEA 3030 benchtop is easy to operate. The Leonardo system software enables rapid generation of the test program and simple debugging. Thanks to the user-friendly Leonardo system software, a test program can be created quickly and easily with just a few clicks.

Desktop or notebook: The SPEA 3030 benchtop is connected to a computer via USB and is immediately ready for use. If required, it can be installed in a 19” housing. In addition, the SPEA 3030 benchtop can be combined with any adaptor unit.

Like all systems in the SPEA 3030 series, the benchtop model also guarantees top test performance.

Easy to use

In just a few simple steps, the SPEA 3030 Benchtop software guides the operator from data import to a stable test program.

Small space requirement: 19″

The SPEA 3030 benchtop was designed as a cost-effective but powerful test solution that requires only a minimum of space. The two front handles allow easy removal and make the SPEA 3030 benchtop the perfect portable tester.

PC-independent architecture

The SPEA 3030 benchtop has its own CPU. This means that the test program runs on the internal processor and is independent of the PC.
This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Modular architecture

The modular architecture of the SPEA 3030 allows you to configure a powerful multifunction tester to suit your requirements. With its 4U 19-inch frame construction, it can be used as a benchtop, but can also be mounted in a standard rack.

Reduction of field returns

Reduction of field returns – The SPEA 3030 benchtop was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 benchtop reliably detects faults that cannot be detected by conventional ICT testers.

True-Per-Pin architecture

SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.

Performance in the smallest of spaces

16-bit instrumentation, 8-wire measurements, PC-independent architecture. Everything has been designed to ensure reliable testing at the lowest possible cost, even after years of intensive use.

Testperformance

  • In-Circuit Test
    With the powerful in-circuit test, the SPEA 3030 benchtop quickly finds every process error: short circuits, open pins, incorrectly assembled or reversed components and components whose values are outside the set parameters.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.

Learn more >

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