Laser Depaneling machine: Best cutting quality and outstanding performance

• PCB milling and cutting with laser
Source
• Support for hybrid printed circuit boards (FPCB,
Rigid-Flex PCB)
• Minimisation of particles through non-contact
Cutting
• High cutting quality compared to contact
Router (100um –> under 30 um)
• Supports the cutting of printed circuit boards with complex shapes
• Stress-free, no mould cutting, no tooling costs

Eigenschaften

• Use of different laser sources such as UV, green, IR, etc.
• Cutting of materials: FR4, FPCBs, Kapton, etc.
• Thickness up to 1.2 mm in the case of FR4 PCB
• Pin table, production device
• Full-cut process, support for highly populated
PCB board
• Best cutting quality (minimisation of charring)
• Clean particle and smoke removal process

Advantages

• Simple setup of BDS (Beam Delivery System)
• Automated management of laser power
• Application of the optimised optical system
• Incredible cost efficiency with 2 tables
• Fully graphical interface and simple programming
• Real-time monitoring of the most important processes
Parameters