ZM-R7220A Infrared SMD rework station is an intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, fast heating and cooling. As an infrared soldering station manufacturer, Zhuomao promises to supply high-quality infrared BGA machines. Significantly, the price of the Zhuomao infrared soldering station is reasonable. Plus, Seamark ZM-R7220A ir rework station is also called zm r6200c in the past.
Functions of the R7220A infrared soldering station
– Temperature monitoring in real time
Real-time temperature display, with automatic curve analysis function.
– Optical alignment system
High-resolution digital CCD imaging (2 million pixels), automatic optical zoom system, manual control and laser red dot alignment.
– Fast heating and cooling
The IR preheating zone is heated by a medium-wave ceramic infrared heating plate, a multifunctional movable PCB holder and a BGA support frame. Laminar integrated cooling fan.
Specifications of the R7220A IR infrared BGA rework station
– Power supply: AC220V±10% 50/60HZ
– Power: 5.65KW(Max), Upper radiator(1.45KW) Lower radiator (1.2KW), IR preheater (2.7KW), Others(0.3KW)
– PCB size: 412*370mm(Max); 6*6mm(Min)
• BGA-Chip size: 60*60mm (Max); 2*2mm (Min)
– IR heater size: 285*375mm
– Temperature sensor: 1 Piece
– Operation: 7″ HD Touchscreen
– Control system: Autonomous heating control system V2（software copyright）
– Display system: 15″ SD industrial display (720P front screen)
– Alignment system: 2 million pixel SD digital imaging system, automatic optical zoom with laser red dot display
– Vacuum adsorption: Automatic
– Alignment accuracy: ±0.02 mm
– Temperature control: K-type thermocouple with closed control loop and an accuracy of up to ±3℃
– Feeding device: No
– Positioning: V-groove with universal fastening
– Dimensions: L685*W633*H850mm
– Weight: 76KG
Difference between a hot air rework station and an IR-infrared BGA rework station
The main difference between a hot air rework station and an IR BGA rework station is the way in which the PCB is heated. A hot air rework station uses heated air to transfer heat from the tool-to-board interface to the solder balls, while an IR BGA rework station uses infrared light to heat just enough of each ball to melt it.
The next important difference is the type of temperature control: hot air rework stations use PID temperature control, while IR BGA rework stations use proportional pressure modulation (PPM). PPM is more precise than PID as it can monitor pressure changes within milliseconds. This means that you can react quickly when applying flux to a PCB or reflowing solder balls on a PCB by adjusting your PPM settings as required. With PID, this would take around 20 seconds per change due to the slow response times of most systems.
Another key difference lies in the airflow control systems; with hot air, no special airflow is required as no cooling is needed during the reflow process, as this is all done outside the oven chamber using an external fan that blows all areas evenly, regardless of whether they are close or far apart.
