ZM-R7830A Intelligent optical BGA rework station

R7830A is an optical alignment automatic rework equipment. It also works as a laser BGA SMD rework station, multi-language menu interface, automatic feeding device, X/Y AXI machine, which can be controlled by joystick, fast and convenient operation, imported high-definition CCD (2 million pixels) optical alignment system, high-precision temperature control sensor system, precise temperature control.

As one of the most reliable manufacturers of BGA rework stations, Seamark ZM offers the best BGA rework station for motherboards with good quality.

Functions of the R7830A laser SMD rework station

 

– Automatic X/Y/Z axis shift
The upper temperature zone of the laser SMD rework station is controlled by the joystick control servo system, which can automatically move and align around the X/Y/Z axis at fast/slow speed.

– Vacuum adsorption and nitrogen protection
The upper heating head has a built-in vacuum suction nozzle for chip adsorption, an electrically controlled 360-degree rotation alignment, with vacuum monitoring and pressure protection device. The lower temperature zone of the laser SMD rework station has a large heating wire layout, moves symmetrically to the upper temperature zone and can be connected to nitrogen to prevent yellowing of the PCBA.

Features of the R7830A laser SMD rework station

 

– Multilingual menu navigation

– Automatic feed device

– X/Y axis can be controlled with joystick, operation is quick and convenient

– Imported high-resolution CCD (2m pixel) optical alignment system.

– High-precision system for measuring temperature control.

Specifications of ZM R7830A Laser SMD Rework Station

 

– Power supply: AC380V±10% 50/60HZ
– Power: 7.15KW(Max), Upper heater (1.45KW) Lower heater (1.2KW), IR preheater (4KW), Other (0.5KW)
– PCB size: 565*467mm(Max); 6*6mm(Min)
– BGA chip size: 80*80mm(Max); 2*2mm(Min)
– IR heater size: 500*380mm
– Motion control: X/Y/Z
– Temperature sensor: 5 pcs.
– Operation: 8″ HD touch panel
– Steuerungssystem: Panasonic PLC + Temperaturregelungsmodul
– Display system: 15″ HD industrial display (1080P 16:9)
– Alignment system: 2 million pixel HD digital imaging system, automatic optical zoom with laser red dot display
– Vakuumadsorption: Automatisch
– Alignment accuracy: ±0.01mm
– Temperature control: thermocouple type K with closed control loop and an accuracy of up to ±1℃
– Feeding device: Yes
– Positionierung: V-Nut mit Universalbefestigung
– Dimensions: L810*W1100*H960mm
– Weight: 151KG

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ZM-R730A BGA rework station for large PCBs

The ZM-R730A is a semi-automatic soldering machine for large BGA circuit boards. The machine has stable temperature control, a large HD touch screen, HD optical alignment and intelligent control as well as removable infrared temperature zone and other advantages. As one of the most reputable and professional BGA Rework Station suppliers, Zhuomao promises to provide you with the best quality products.

Functions of the R730A semi-automatic soldering machine for large PCBs

 

– Stable temperature control

Three independently adjustable temperature zones, heated by convection hot air, the lower temperature zone is adjustable in height, the upper temperature zone has a built-in vacuum suction nozzle for chip adsorption, with negative pressure monitoring and pressure protection device.

– Großer HD-Touchscreen

Large HD touch screen operation with a variety of operating modes, real-time display, and edit temperature curve, each group of temperature curve can be set to 8 segments, can store 100 groups of temperature curve, can automatically analyze the curve, read through touch screen control.

– Removable infrared temperature zone

The IR preheating zone is heated by a carbon fiber infrared tube and protected by a high-temperature resistant microcrystalline plate. It can be moved to the left and right to facilitate the maintenance of large and irregular PCBA.

– Optical HD alignment and intelligent control

Ausgestattet mit automatischer Zuführung Gerät, mit Panasonic PLC und hochpräzise Temperaturregelung Modul, hochpräzise K-Typ-Thermoelement, dynamische PID-Multi-Loop-Regelung selektive Reflow-Lötprozess, kann die Genauigkeit ± 1 ℃ erreichen. Übertemperaturschutz-Alarmfunktion, Software-Verschlüsselung und narrensichere Funktion.

Specifications of the R730A Large Board semi-automatic soldering machine

 

– Power supply: AC380V±10% 50/60HZ
– Power: 7.75KW(Max)，Upper heater(1.45KW) Lower heater (1.2KW)，IR Preheater (4.8KW), Others(0.3KW)
– PCB size: 632*520mm(Max); 6*6mm(Min)
– BGA chip size: 80*80mm (Max); 3*3mm (Min)
– IR heater size: 570*435mm
– Temperature sensor: 5 pcs.
– Operation: 10″ HD touchscreen (1080P 16:9)
– Control system: Panasonic PLC + temperature control module
– Display system: 15″ HD industrial display (1080P 16:9)
– Alignment system: 2 million pixel HD digital imaging system, automatic optical zoom with laser red dot display
– Vacuum adsorption:Automatic
– Alignment accuracy: ±0.01mm
– Temperature control: K-type thermocouple with closed control loop and an accuracy of up to ±1℃
– Feeding device: Yes
– Positionierung: V-Nut mit Universalbefestigung
– Dimensions: L1000*W835*H960mm
– Weight: 130.5KG

 

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ZM-R7220A BGA infrared soldering station

ZM-R7220A Infrared SMD rework station is an intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, fast heating and cooling. As an infrared soldering station manufacturer, Zhuomao promises to supply high-quality infrared BGA machines. Significantly, the price of the Zhuomao infrared soldering station is reasonable. Plus, Seamark ZM-R7220A ir rework station is also called zm r6200c in the past.

Functions of the R7220A infrared soldering station

 

– Temperature monitoring in real time

Real-time temperature display, with automatic curve analysis function.

– Optical alignment system

High-resolution digital CCD imaging (2 million pixels), automatic optical zoom system, manual control and laser red dot alignment.

– Fast heating and cooling

The IR preheating zone is heated by a medium-wave ceramic infrared heating plate, a multifunctional movable PCB holder and a BGA support frame. Laminar integrated cooling fan.

Specifications of the R7220A IR infrared BGA rework station

 

– Power supply: AC220V±10% 50/60HZ
– Power: 5.65KW(Max), Upper radiator(1.45KW) Lower radiator (1.2KW), IR preheater (2.7KW), Others(0.3KW)
– PCB size: 412*370mm(Max); 6*6mm(Min)
• BGA-Chip size: 60*60mm (Max); 2*2mm (Min)
– IR heater size: 285*375mm
– Temperature sensor: 1 Piece
– Operation: 7″ HD Touchscreen
– Control system: Autonomous heating control system V2（software copyright）
– Display system: 15″ SD industrial display (720P front screen)
– Alignment system: 2 million pixel SD digital imaging system, automatic optical zoom with laser red dot display
– Vacuum adsorption: Automatic
– Alignment accuracy: ±0.02 mm
– Temperature control: K-type thermocouple with closed control loop and an accuracy of up to ±3℃
– Feeding device: No
– Positioning: V-groove with universal fastening
– Dimensions: L685*W633*H850mm
– Weight: 76KG

Difference between a hot air rework station and an IR-infrared BGA rework station

 

The main difference between a hot air rework station and an IR BGA rework station is the way in which the PCB is heated. A hot air rework station uses heated air to transfer heat from the tool-to-board interface to the solder balls, while an IR BGA rework station uses infrared light to heat just enough of each ball to melt it.

The next important difference is the type of temperature control: hot air rework stations use PID temperature control, while IR BGA rework stations use proportional pressure modulation (PPM). PPM is more precise than PID as it can monitor pressure changes within milliseconds. This means that you can react quickly when applying flux to a PCB or reflowing solder balls on a PCB by adjusting your PPM settings as required. With PID, this would take around 20 seconds per change due to the slow response times of most systems.

Another key difference lies in the airflow control systems; with hot air, no special airflow is required as no cooling is needed during the reflow process, as this is all done outside the oven chamber using an external fan that blows all areas evenly, regardless of whether they are close or far apart.

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ONYX 25

 

TECHNICAL DESIGN

The ONYX series, which has won design awards, combines a stable, innovative design in terms of both handling and construction. The ONYX 25 is designed to hold oversized PCBs safely and securely.

CIRCUIT BOARD PREHEATER

The preheater has a standard output of 3500 W with a surface area of 300×300 mm, which can be increased to 7000 W with a surface area of 600×300 mm using an additional preheater module. With this level of performance, the necessary temperature profile for excellent lead-free soldering results can be defined, even for oversized PCBs.

 ONYX 25 MAIN FEATURES

  • AXLE CONTROL
    4 motorized axes, controlled in a closed control loop
  • DESIGNED FOR EXTRA-LARGE PCBs,
    for PCBs up to 520 mm wide, with no restriction in length thanks to the open design
  • POWERFUL TOP AND BOTTOM HEATING
    2000 W top heater; 3500 W 300x300mm per preheater module (max. 2)
  • UP TO 8 THERMOCOUPLE INPUTS
    to control the process temperature
  • AUTOMATIC RESIDUAL SOLDER REMOVAL
    Option for removing residual solder from the solder joint after desoldering a component
  • FLOW CONTROL IN THE CLOSED CONTROL LOOP
  • STANDARD ZEVAC GAS NOZZLES
  • PCB HOLDER
    for holding even irregularly shaped PCBs without the need for additional fixing
  • FORCE MEASUREMENT,
    Force measurement in closed loop for automatic pick-up, fluxing, placement and desoldering.
  • VISION
    The new MFOV VISION system allows the complete view of components up to a size of 75x75mm, the light intensity of the illumination with LED can be changed.

 

RESIDUAL SOLDER REMOVAL
With the residual solder removal option, the residual solder is removed without contact after desoldering a component, without touching and thus damaging the surface of the PCB. The land surface is cleaned and prepared for soldering a new component after flux and solder paste have been applied.MOVABLE SOLDERING HEAD
The combination of the open machine design with the movable soldering head allows free positioning in the X-axis without having to move the PCB. As the PCB remains in position, precise positioning of the component is guaranteed. For quick positioning above the work area.VISION-SYSTEM
The advanced MFOV VISION system is part of the standard scope of delivery of all selective soldering devices in the ONYX series. It allows the complete view of components up to a size of 75 x 75 mm, but also smaller ones with an edge length of 0.3 mm.FORCE MEASUREMENT
Force measurement is also standard on all selective soldering devices in the ONYX series. During placement, it protects sensitive components with a preselected contact force.REPEATABLE AND PRECISE AUTOMATION
The VISUAL MACHINES™ machine software developed in-house is the basis for fast and flexible profile creation. The profiles stored in the library and the performance features of the machine guarantee repeatable, precise selective soldering results.LEAD-FREE APPLICATIONS
All ONYX appliances from ZEVAC are supplied with a nitrogen connection as standard. This and the powerful top heating of 2000W and preheating of 3500W (7000W) provide the basis for reliable soldering results, even with lead-free operation.

 

 

 
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