XC1000

XC1000 Offline X-ray SMD component counter

Exclusive introductory offer: Seamark XC1000 X-ray component counter for only

49’000 CHF

XC1000 is a fully automatic microfocus X-ray counting system.
It uses X-Ray perspective principle and independently developed algorithm software with AI function, which can quickly and accurately calculate the number of materials in the material roll. This X-ray chip counter also has MES data upload and automatic printing of material labels. To achieve the function of improving work efficiency and saving labor.


Product features

– Compared to conventional counting/puncturing machines, the roll in the X-ray roll counter does not have to be unpacked or reloaded.

– Suitable for all types of chip components, SMD components above 01005.

– The accuracy of the count reaches more than 99.99%.

– The measurable roller diameter is 7-15 inches.

– Innovative detection environment and algorithm with AI function.

– Realizes automatic counting.


Specification of the offline component counter XC1000

X-ray tube source specifications
• Type: Sealed microfocus X-ray tube
• Voltage: 80 kV
• Operating voltage range: 30-80 kV
• Operating current range: 200-700μA
• Maximum output power: 56W
• Microfocus spot size: 30μm-40μm


Flat Panel Detector Specification
• Type: TFT Industrial Dynamic FPD
• Pixel Matrix: 3072×3072
• Field of View: 427mm×427mm
• Resolution: 3.6Lp/mm
• Frame Rate: (1×1) 6fps
• A/D Conversion Bit: 16bits


• Dimensions: L800mm×W1260mm×H1950mm
• Input power: 220V 10A 50-60Hz
• Maximum sample size: 450mm×450mm
• Control: Industrial PC WIN7/ WIN10 64bits
• Net weight: approx. 800KG
• Radiation: <1μSv/h


Special offer: Seamark XC1000 offline X-ray SMD component counter for only CHF 49,000

The manufacturing industry is constantly faced with the challenge of increasing productivity while maintaining precise quality standards. The precise counting of components plays a decisive role in this quest for efficiency. To fulfill these requirements, we proudly present our latest product, the Seamark XC1000 X-Ray component counter. And to celebrate the market launch in style, we are offering the first three orders at an unbeatable introductory price of just CHF 49,000.

Technological innovation for precise component counting

The Seamark XC1000 redefines the standards for precision and efficiency in component counting. Using the latest X-ray technology, this component counter enables even the smallest components to be detected accurately and quickly. This leads to considerable time savings and at the same time ensures error-free counting, which contributes to improved product quality.

Key functions of the Seamark XC1000:

  1. Next generation X-ray technology: The Seamark XC1000’s advanced X-ray technology penetrates materials precisely, ensuring accurate counting of a wide range of components.
  2. Speed and efficiency: Thanks to its automated processes, the Seamark XC1000 enables a significant increase in productivity by counting and logging components in record time.
  3. User-friendly interface: The intuitive user interface of the Seamark XC1000 makes operation simple and efficient. Even inexperienced operators can be quickly trained to exploit the full potential of the device.

Exclusive introductory offer

To celebrate the launch of the Seamark XC1000, we are offering the first three orders at an exclusive introductory price of just CHF 49,000. This offer is a unique opportunity for companies to benefit from the advantages of this ground-breaking technology without straining their budget.

How you can order

To benefit from this exclusive offer, simply contact neutec electronic ag. Availability is limited, so don’t hesitate to express your interest and ensure your company can benefit from this unique opportunity.

The Seamark XC1000 sets new standards in component counting and will undoubtedly become an indispensable tool for companies striving for maximum precision and efficiency in their production. Get it now and secure this outstanding product at an unbeatable price.

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ZM-R730A semi-automatic BGA soldering machine

ZM-R730A semi-automatic BGA soldering machine – precision for large printed circuit boards

The ZM-R730A semi-automatic BGA soldering machine is specially designed for reworking large printed circuit boards. It combines precise temperature control, HD optical alignment, and intelligent control in a robust and user-friendly machine. This soldering station is a powerful tool for electronics manufacturers who require the highest quality in BGA and SMD repairs. As one of the leading suppliers of rework stations, Zhuomao guarantees durable products and consistently precise results.

Stable temperature control for precise soldering

The ZM-R730A has three independently controllable temperature zones that are heated by convection hot air. The lower zone is height-adjustable, while the upper zone has an integrated vacuum suction nozzle. Negative pressure monitoring and pressure protection ensure maximum safety during the soldering process. This combination guarantees uniform heating and prevents thermal damage to sensitive components.

Large HD touchscreen and smart controls

The large HD touchscreen displays all processes in real time. Users can edit and analyze temperature curves and save up to 100 different profiles. The system uses a Panasonic PLC controller and a K-type thermocouple with an accuracy of ±1 °C. PID multi-loop control keeps the temperature constant throughout the entire process. An integrated over-temperature warning function and software encryption increase operational safety.

Removable infrared temperature zone for flexibility

The infrared preheating zone is heated by a carbon fiber IR tube and covered by a microcrystalline protective plate. It can be moved sideways to easily maintain large or irregular boards. This makes work much easier and increases the longevity of the system.

Optical HD alignment for precise placement

With a 2-megapixel HD imaging system and laser red dot indicator, the ZM-R730A ensures precise optical alignment. The alignment accuracy is an impressive ±0.01 mm. This feature guarantees error-free placement of even the smallest BGA components.

Technical data for the ZM-R730A soldering machine

  • Power supply: AC380V ±10% 50/60 Hz

  • Power: 7.75 kW (max.)

  • PCB size: max. 632 × 520 mm

  • BGA size: max. 80 × 80 mm

  • Alignment accuracy: ±0.01 mm

  • Display: 15″ HD industrial display

  • Temperature sensors: 5 pieces

  • Weight: 130.5 kg

Zhuomao – Quality and Innovation

Zhuomao is one of the most renowned manufacturers of BGA rework systems, offering machines designed for reliability, precision, and durability. The ZM-R730A semi-automatic BGA soldering machine combines technological innovation with ease of use—ideal for modern electronics repair and manufacturing.

Find out more about Zhuomao’s high-quality rework solutions on the official Seamark website.

ZM-R7220A Infrared SMD Rework Station

ZM-R7220A Infrared SMD Rework Station – Intelligent technology for precise rework

The ZM-R7220A infrared SMD rework station is a modern and intelligent infrared soldering station with real-time temperature monitoring, an optical alignment system, and a fast heating and cooling function. Developed by Zhuomao, a leading manufacturer of rework systems, it offers maximum precision and reliability when working with sensitive BGA and SMD components. It is also attractively priced without compromising on quality or performance.

Real-time temperature monitoring for maximum control

The ZM-R7220A infrared SMD rework station monitors the temperature in real time. Temperature curves are automatically analyzed and displayed via the integrated 7-inch HD touchscreen. This provides the user with precise feedback throughout the soldering process and allows adjustments to be made immediately.

Optical HD alignment system for precise work

The integrated 2-megapixel CCD imaging system provides a clear and detailed display. Automatic optical zoom and laser red dot alignment enable components to be positioned precisely. The alignment accuracy is ±0.02 mm, which is particularly important for fine BGA components.

Fast heating and cooling with efficient IR technology

The IR preheating zone uses a medium-wave ceramic infrared heating plate with even heat distribution. A movable PCB holder and a BGA support frame enable flexible working. The integrated cooling system with laminar air flow ensures controlled and rapid cooling after the reflow process.

Technical specifications of the ZM-R7220A

  • Power supply: AC220V ±10% 50/60 Hz

  • Power: 5.65 kW (max.)

  • PCB size: max. 412 × 370 mm

  • Alignment accuracy: ±0.02 mm

  • Temperature accuracy: ±3 °C

  • Display: 15″ SD industrial display

  • Weight: 76 kg

  • Positioning: V-groove with universal mounting

Hot air vs. infrared – the key differences

The main difference between a hot air rework station and an infrared BGA rework station lies in the type of heating used.
Hot air systems use heated air to heat the solder joints. Infrared systems such as the ZM-R7220A use IR radiation to heat each solder joint specifically until the solder melts.

Another advantage of infrared technology is its more precise temperature control. While hot air stations are usually based on PID control, the ZM-R7220A uses a PPM (Proportional Pressure Modulation) system that detects and corrects pressure and temperature changes within milliseconds. This allows the system to react more quickly and prevents thermal damage to sensitive components.

There is also a difference in cooling: IR systems do not require a strong air flow, as cooling is achieved through controlled air circulation within the system – ideal for consistent results without deformation of the circuit board.

Zhuomao – Quality and Innovation

Zhuomao has been synonymous with high-quality rework technologies for years. The ZM-R7220A infrared SMD rework station combines efficiency, precision, and user-friendliness. Thanks to innovative sensor technology, fast heat transfer, and optical control, it is ideal for repairing modern electronics.

You can find out more about Zhuomao’s rework systems on the official Seamark ZM website.

X7600 Offline X-ray machine

The X7600 offline X-ray machine uses the world-leading Japanese Hamamatsu X-ray source, which is renowned for its exceptional image quality, long service life, and high operational reliability. By integrating this high-quality source, the system achieves impressive precision in defect detection and enables reliable, detailed imaging of even the smallest internal structures of electronic components. This makes the device an indispensable tool in modern electronics manufacturing and in the quality assurance of demanding production processes.

The X7600 industrial X-ray machine is specially designed to quickly and accurately identify critical defects in semiconductor packaging. This includes detecting defects such as bent gold wires, broken wire connections, or insufficiently bonded contacts, which often only become visible under high magnification or using special X-ray techniques. With its powerful X-ray technology, the system can reliably evaluate even complex bonding processes and provides a clear basis for quality decisions and process optimization.

A particular advantage of the X7600 is its extremely large work platform, which enables the loading and testing of large-format electronic assemblies. This means that not only standard circuit boards but also very large industrial control motherboards or exceptionally long electronic components can be analyzed. Typical examples include long LED light strips, multilayer circuit boards, or specially manufactured assemblies for industrial applications. The system is therefore extremely flexible and ideal for production environments with a high degree of variety.

Thanks to its robust construction, intuitive user interface, and versatile settings, the device can be easily integrated into existing production processes. The controls are designed so that even users without in-depth X-ray knowledge can use the machine efficiently. Automatic inspection programs, freely definable inspection profiles, and comprehensive analysis tools help to standardize inspection procedures while speeding up evaluation.

The X7600 is used in a wide range of areas in the electronics industry – from semiconductor manufacturing and LED technology production to the construction of complex control and communication systems. Whether in research and development, series production, or end-of-line quality control, the device delivers consistently high image quality and enables reliable, non-destructive inspection of electronic components. It thus makes a decisive contribution to increasing product quality, reducing error rates, and boosting the efficiency of the entire manufacturing process.


Merkmale des X7600 Offline-Röntgengerät

– Electronics manufacturing/semiconductors/photovoltaics/connectors/LED, etc.

– High-resolution inspection image: Offset/bonded tin/blase/cold solder/solder wire.

– 130KV 5μm closed X-ray tube, long service life, maintenance-free.

– 2.3 million high-resolution digital flat panel detector.

– 5 AXI X-ray linking system.

– Observation at 60 degrees.

– 360-degree rotation of the platform.

– Color image navigation.

-Supports image stitching function (optional).
Upgradeable 3D module (industrial CT) (optional).
Automatic test plan adjustment (optional).


Specifications of the X7600 offline X-ray machine

X-ray tube source specifications
• Type: Sealed microfocus X-ray tube
• Voltage: 90 kV (130 kV optional)
• Operating voltage range: 40-90KV/130KV
• Operating current range: 10-200 μA/300μA
• Maximum output power: 8 W/39W
• Microfocus spot size: 5-15μm


Flat Panel Detector Specifications
• Type: CMOS flat panel detector
• Pixel Matrix: 1172×1100
• Field of View: 58mm×54mm
• Resolution: 10.1Lp/mm
• Frame Rate: (1×1) 30fps
• A/D Conversion Bit: 14bits


• Dimensions: L1700mm×W1770mm×H1800mm
• Input power: 220V 10A/110V 15A 50-60Hz
• Maximum sample size: 500mm×500mm
• Control: Industrial PC WIN7/ WIN10 64bits
• Net weight: approx. 1900KG
• Radiation: <1μSv/h
• Max tilt angle: 65 degrees

X6600 Offline X-ray machine

The X6600 offline X-ray machine is a cost-effective, universally applicable offline precision microfocus X-ray inspection device. It is suitable for the inspection of various offline products in the factory. This AXI inspection machine has the features of high magnification, multi-angle inspection and a large-area inspection platform.


Features of the X6600 offline X-ray machine

 

– Meets the requirements of general industrial X-ray equipment and offers a wide range of applications.

– A high-resolution design can get the best image in a very short time.

– Infrared automatic navigation and positioning, quickly select the recording position.

– CNC detection mode, fast automatic detection for multi-point array.

– Oblique multi-angle inspection makes it easier to detect sample defects.

– The software developed by Seamark is simple and easy to use and has low operating costs.

– The X-ray tube and the FDP can be rotated simultaneously (0-60°), making the detection image clearer and more intuitive.


Specifications of the X6600 offline X-ray machine

 

Spezifikation der Röntgenstrahlungsquelle

• Type: Sealed microfocus X-ray tube
• Voltage: 90 kV/130 kV
• Operating voltage range: 40-90 kV/130 kV
• Operating current range: 10-200 μA/300 μA
• Maximum output power: 8 W/39 W
• Microfocus spot size: 5-15 μm


Flat screen detector specification

• Type: TFT industrial dynamic FPD
• Pixel matrix: 1536×1536
• Field of view: 130mm×130mm
• Resolution: 5.8Lp/mm
• Image: (1×1) 20fps
• A/D conversion bit: 16bits


Size: L1360mm×W1240mm×H1700mm
Input power: 220V 10A/110V 15A 50-60Hz
Maximum sample size: 540 mm×440mm
Control: Industrial PC WIN7/ WIN10 64bits
Net weight: approx. 1170KG
Radiation:<1μSv/h
Max tilt angle: 65 degrees

 

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Other inspection equipment ->

X5600 Offline X-ray inspection equipment

The X5600 offline X-ray inspection device is a small, precise microfocus X-ray inspection device that is suitable for R&D companies, laboratories, quality control rooms, etc. It is the first choice for X-ray inspection devices for small parts. The IC chip X-ray inspection machine is a device for non-destructive testing, in particular for the prospective inspection of internal defects in IC chips. It is one of the best methods for detecting defects in IC chips. The X-ray inspection device mainly relies on the internal X-ray tube, which emits X-rays to irradiate the IC chip for imaging. Once the X-rays have penetrated the object, the digital tablet receives the image signal and transmits it to the computer. After software processing, the image is displayed on the screen in real time. X-ray testing belongs to the category of non-destructive testing of IC chips. The tested samples can be reused, effectively reducing production and testing costs.


Functions of the Seamark X5600 offline X-ray inspection device

 

Automatic void ratio calculation

Improved BGA test function

The X5600 industrial X-ray inspection machine can quickly select and mark individual solder balls or select the solder balls to be inspected by matrix box; it can manually or automatically identify BGA solder balls and complete the inspection. Follow the system guidelines to make the inspection process easy and ensure accurate and reliable inspection results.

 


Size measurement

Measuring tools

Distance, distance ratio, line distance, angle, arrow mark, circle radius, point distance, circle center distance, circumference, hand-drawn polygon, hand-drawn freeform, etc. can add a text description.

 


Defect inspection

Detect defects automatically

The X5600 can automatically detect size, area, wire breakage, bridging, etc.

Customizable image algorithm

Customized software algorithms based on product features and requirements for fully automated defect inspection algorithms, including Y/N, crack, wire break, offset size and quantity, etc.


CNC inspection

Automatic CNC operational check

The X5600 supports the automatic CNC multi-point inspection mode, which is based on the product feature of multi-point coordinates for automatic inspection.

Automatic CNC operation detection

Automatically save images, create reports, also supports batch inspection.


Tilt/rotate function

Function for checking the tilt angle

The X5600 detector manufactured by Zhuomao supports a tilt angle of ±30°. In cases where the photo taken on the front of a specific device cannot identify the defective feature, the tilt function can be used to view the features of the device from multiple angles, making it easier to analyze and identify the defect.

360° rotating photo inspection function

Equipped with a rotating manipulator that can rotate 360 degrees to capture images, there is no blind spot for defect observation.


Advantages of the Seamark X5600 offline X-ray inspection device

 

– Miniaturized equipment, easy to install and operate.

– Applicable for chip, LED, BGA/CSP, wafer, SOP/QFN, SMT and PTU packaging, sensors, connectors and precision casting inspection.

– High-resolution design to get the best image in a very short time.

– Automatic infrared navigation and positioning function for quick selection of the recording location.

– CNC inspection mode for fast and automatic inspection of multi-point fields.

– The inclined multi-angle inspection facilitates the inspection of sample defects.

– Simple software operation, low operating costs.

– Long service life.


Drawing of the Seamark X5600 offline X-ray inspection machine

 


Specifications of the X5600 offline X-ray inspection device

 

X-ray tube source specifications
• Type: Sealed microfocus X-ray tube
• Voltage range: 40-90KV
• Current range: 10-200 μA
• Maximum output power: 8 W
• Microfocus spot size: 15μm

Flat Panel Detector Specification
• Type: TFT Industrial Dynamic FPD
• Pixel Matrix: 768×768
• Field of View: 65mm×65mm
• Resolution: 5.8Lp/mm
• Frame Rate: (1×1) 40fps
• A/D Conversion Bit: 16bits

• Dimensions: L850mm×W1000mm×H1700mm
• Input power: 220V 10A/110V 15A 50-60Hz
• Maximum sample size: 280mm×320mm
• Control system: Industrial PC WIN7/ WIN10 64bits
• Net weight: Approximately 750KG


Safety aspects of the X5600 offline X-ray inspection device

 

Obtaining an exemption from the Ministry of Ecology and Environment of the People’s Republic of China

The X5600 received the certification document (sixth batch) for the exemption permit for radioisotope and radiation equipment from the Ministry of Ecology and Environment with the entry number [Yuehuan [2018] No. 1688]. The radiation device with this product model of our company can be exempted from the radiation protection license.

Design of the safety guard

According to the “Basic Standards for Ionizing Radiation Protection and Safety of Radiation Sources” (GB18871-2002), the radiation protection exemption standard is ≤1uSv/h, the design standard of this product is ≤0.5uSv/h, which is 1/10 of the amount of radiation in the natural environment.

Components Multiple safety protection

Equipped with OMRON’s safety control element, triple safety protection sensor and direct connection control with the radiation source, it fully complies with CE specifications and the semiconductor industry’s SEMI S2/S8 specifications.

 

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Other inspection equipment ->

R7830A Laser BGA SMD Rework Station

R7830A Laser BGA SMD Rework Station – Automatic precision for modern electronics

The R7830A Laser BGA SMD Rework Station is a sophisticated solution for precise rework of modern printed circuit boards. This device combines laser technology, optical alignment, and automatic control to ensure maximum efficiency in the repair and assembly of SMD and BGA components. Seamark ZM is one of the leading manufacturers of such systems and, with the R7830A, offers a model that perfectly combines quality and innovation.

Precise optical alignment and simple control

The R7830A features an imported HD CCD camera system with two million pixels, ensuring precise optical alignment. The joystick-controlled X/Y/Z axis system allows the operator to position components quickly and accurately. Operation is easy and convenient thanks to the multilingual menu and 8-inch HD touch panel.

Automatic X/Y/Z axis movement and vacuum adsorption

The system operates with automatic movement in all three axes. The upper heating head is equipped with a vacuum suction nozzle and a 360-degree rotation function, allowing chips to be placed precisely. The device also offers nitrogen protection, which prevents circuit boards from yellowing during the soldering process.

Intelligent temperature control for maximum quality

Technical highlights of the R7830A Rework Station

  • Power supply: AC380V ± 10%, 50/60 Hz

  • Power: 7.15 kW (max.)

  • PCB size: max. 565 × 467 mm

  • Alignment accuracy: ±0.01 mm

  • Display: 15″ HD industrial display (1080p)

  • Temperature sensors: 5 pieces

  • Dimensions: L810 × W1100 × H960 mm

  • Weight: 151 kg

Quality of Seamark ZM

Seamark ZM stands for durability and technical precision. The R7830A Rework Station was developed to meet the demands of challenging manufacturing and repair processes. Thanks to its combination of automatic alignment, precise temperature control, and ease of use, it is ideal for electronics manufacturers and repair shops.

Further information about modern rework systems can be found on the official Seamark ZM website.