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SPEA T100L

Automatic LED test system

Complete detection of LED light defects

The SPEA T100L automatic LED test system reliably detects defects in electronic components for LED lighting applications. It fulfils all the requirements of high-volume series production and eliminates the need for expensive adapters with fibre optic cables.

 

 

The SPEA T100L LED tester offers exceptional performance in LED testing, eliminating the need for manual functional testing and meeting production cycle times. The integrated flying scanner technology captures and processes the intensity and colour parameters of each LED light pixel in parallel, allowing multiple LED characteristics to be captured in a single pass.

 

Testing LEDs in conjunction with electronic assemblies is a complex process with high requirements.

The challenge in testing lies in the variability of light intensity and colour temperature, the parallel testing of the assembly while simultaneously checking the correct position of the individual LEDs – an area in which efficient automation of the testing process guarantees high profitability.

The SPEA T100L LED tester is the latest system in the SPEA flying head series. The tester is based on proven testing technology and offers the highest performance – a worthwhile investment.


Higher product quality through additional testing techniques

Performing additional tests on electronic components along the functional chain of LED luminaires ensures that faulty products are filtered out.
SPEA test systems offer complete test coverage without increasing the complexity of the production environment.


SPEA T100L Documentation PDF

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SPEA T300

In-circuit tester with highest parallelism

32-fold parallel test

The SPEA T300 board tester has a unique tester architecture with up to 32 parallel incircuit test cores and additional capacity of 256 cores for flashing and functional testing. The asynchronous parallel architecture of the SPEA T300 allows testing and parallel flashing of up to 32 PCBAs (Printed Circuit Board Assembly).

The SPEA T300 Needlebed Tester offers SPEA’s unique ICT-Plus technology, which finds electronic faults that are not detected by conventional ICT tests.

Test and flash a variety of assemblies in parallel

Many assemblies are manufactured in the panel, i.e. a few to a large number of assemblies are connected in the panel assembly to form a large printed circuit board. Each of these individual assemblies in turn contains a few to countless components and parts that must be tested and programmed.

SPEA’s new T300 board tester is specifically designed for user testing, or testing and programming many boards at once. It thus guarantees the highest throughput and the lowest testing and programming costs.

 

 

Programmable as single or dual test station

The SPEA T300 can be programmed as a single or dual test station.

In Single Test Site mode, a single board can be ICT and function tested and flashed.

Dual Test Side enables the simultaneous testing of two boards. This applies to ICT, flash programming and functional testing. To double the throughput, the tester can perform a split test. At Station 1, for example, an ICT is performed while at Station 2 either flashing or a functional test is performed simultaneously.

Operatorless testing

The SPEA T300 can be configured in several automated operating modes that operate unattended

  • Inline loading – Inline unloading
  • Loading from rack – inline unloading [1]
  • Inline loading – unloading in rack [1] [2].
  • Loading from rack – unloading into rack [1] [2].

[1] Option: Rack loading by robot
[2] Option: Pass – Fail – Sort

In-circuit tester – connected to the digital ecosystem

The SPEA T300 interacts with the Industrie 4.0 environment and digital ecosystem – in terms of information, notifications, programming commands and machine instructions.

The tester has sensors to detect and observe the environment, wear parts and moving parts, electrical and pneumatic power supplies, and internal and external power supplies. This enables him to:

  • Support for predictive maintenance
  • Error detection in advance, which would lead to malfunctions
  • Estimation of wear and remaining service life of machine parts

The SPEA T300 is designed for continuous and intensive use even in harsh manufacturing environments. Easy to maintain – maintenance can be performed easily and quickly.

ATOS Leonardo 4 ICT is the T300 version of the ATOS system software developed by SPEA for its testers.

ATOS contains all the operating and programming functions needed for the tester. This makes you independent of the Windows® version and the configuration and performance of the system PC.

 

 

 

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SPEA Automatisiertes Board Handling

SPEA Board Handling

Minimized footprint, maximum effectiveness

Fully compatible with all inline-capable SPEA testers

The automated board handling system, developed and produced by SPEA, enables the automatic loading of assemblies and components from rack to tester and from tester to rack.

The handling modules are fully compatible with all inline-capable SPEA test systems – both existing and new systems. The use of SPEA modules ensures absolute compatibility between handling and tester, and therefore reliable production. Our customer service offers you professional support during installation and beyond.

Modular handling equipment with a small footprint

The automated board handling system from SPEA is characterized by a compact, modular architecture and thus offers a cost-effective system with a small footprint.

The modular architecture allows you to configure your handling system to suit your needs. The modules can be added, exchanged or moved within the same or in other test cells to change the conveying path (pass-back, pass-through or mixed). This means you are optimally equipped for every requirement in current or future production.

All modules of the SPEA handling system require only 1/3 of the floor space of conventional handling segments. The smallest module has a footprint of just 0.7 square meters. A typical pass-through configuration takes up just 1.31 square meters of space – compared to 3.38 square meters for conventional automation solutions.

Rack positioning can be carried out manually or automatically in various ways, e.g. with AGVs, robots, conveyor belts or local magazine buffers. The rack positioning height is programmable to simplify operating procedures or to set the correct height for operation with robots or AGVs.

Designed for the future of testing

The handling of the assembly is completely controlled by the SPEA tester software. Communication between the tester and LAN via the Ethernet TCP/IP interface utilizes the benefits of Industry 4.0: production and sensor data can be transferred to big data systems for predictive maintenance.

The SPEA handling system consists of durable, maintenance-free modules to ensure operational reliability over a long period of time. The sensors used in combination with the software used ensure that all steps are carried out in a fully controlled manner.

Full integration with SPEA tester and software

Installation of the SPEA handling modules is professional and simple: they simply need to be connected to the power supply and the communication interfaces of the tester (SMEM, Hermes, TCP/IP) – that’s it! The tester software contains all the necessary drivers for controlling automated handling.

The desired operating mode of the handling system (e.g. pass-through or pass-back) can be selected directly in the test program, so that no additional operating effort is required when changing products.

The sorting of the assemblies can also be defined directly in the test program. For example, with pass-fail sorting in the same magazine, in separate magazines or in permanently assigned magazine slots.

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SPEA 4080X Flying Probe Tester

Test of power electronics
The first tester to perform an incircuit test on power electronics assemblies

Automatic test of big
and complex boards

The SPEA 4080X is designed for adapterless testing of power electronics assemblies – including inverters, power supplies, power supplies and high density assemblies.

The tester easily and automatically transports large and heavy assemblies (15 kg and more) and tests them ultra-fast and with high precision – digital, analog, power electronics, supercapacitors, tests under high voltage or of relays as well as polarity tests and, of course, mechanical elements such as magnets, LEDs, displays, etc.

Furthermore, the system offers additional techniques such as optical testing, flashing or RTC calibration, etc.

Advantages

Testing power boards with the SPEA 4080X offers great advantages:
The failure rate during the final function test (end-of-line test) is almost zero
Reliable and precise diagnosis at component level significantly reduces repair costs. A long and time-consuming search for the cause of the error is no longer necessary.
Early error detection ensures optimized workflows and processes
Test equipment for functional and end-of-line testing can be simplified, reducing overall test time.

Performance features

Max. Component height: 150 mm

The SPEA 4080X has been designed to easily and fully test assemblies with components up to 150 mm high.
No other flying probe tester can test boards with components of this height and even increase the test depth, as it also contacts where needle bed testers reach their limit.

Automated handling of large boards

Operator-free operation, direct integration into SMT lines or test cells

Complete tests

No failures during final functional/EOL test, reduction of field returns.

High throughput

Lowest test costs, Direct integration into SMT lines or test cells

180 contacts/sec

Unique drive technology with linear motors and optical encoders on all axes (X, Y and Z) guarantees maximum acceleration and extremely precise contacting. Unique drive technology with linear motors and optical encoders on all axes (X, Y and Z) guarantees maximum acceleration and extremely precise contacting.

Min. Pad size: 50 µm

The extremely precise contacting accuracy is achieved by linear optical encoders on all axes. The SPEA 4080X contacts 50μm pads at highest speed and absolutely precise without leaving any traces – unique in the flying probe range.
The programmable pressure force and soft landing function ensure that even the most sensitive electronic components (ultra fine pitch, sticky boards during product start-up, flex assemblies) are contacted precisely and quickly without risk of damage.

Highest error coverage

The SPEA 4080X offers the full range of test capabilities with the highest measurement accuracy. The shorter the distance between the needle and the measuring instrument, the faster and more accurate the measurement performed. Therefore, in SPEA Flying Probe systems, the measuring and stimulation instruments are positioned as a test head directly on the needles – the “flying tester concept”. That’s why SPEA testers are the fastest and the most accurate.

Innovative granite chassis

An innovative granite chassis combined with state-of-the-art linear motor technology provides unprecedented contacting precision with extremely fast test speed at low vibration and highest thermal stability.
Compared to conventional iron or steel, natural granite offers the best damping properties and thermal stability, minimizing vibration and deformation effects that would affect accuracy and reliability over time.

Compact footprint: 2.4 m2 (25.83 ft2)

The footprint of the SPEA 4080X is very compact: it requires only 2.2 m2 including inline feed.

Can replace needle bed tester

Due to its speed and the associated high productivity, the SPEA 4080X can easily be used where previously only needle bed testers were used, for example also in high-volume serial production.

High precision measurements

High-precision measurement performance and accuracy (0.1pF), Signal integrity, No degradation of measurement results or interference, Instantaneous signal acquisition, Unique repeat accuracy

Up to 28 Top & Bottom Flying Tools

The eight axes of the SPEA 4080 (4 top + 4 bottom) allow the installation of up to 28 flying tools in total: In addition to the probes with which all electrical tests are performed, a variety of other tools are available to extend the test performance of the SPEA 4080.

 

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SPEA 3030X In-Circuit Tester

Test of power electronics

 

Automatic testing of large and complex boards

The SPEA 3030X is designed for fixtureless testing of power electronics assemblies – including inverters, power supplies, power supplies and high density assemblies.

The tester easily and automatically transports large and heavy assemblies (10 kg and more) and tests them ultra-fast and with high precision – digital, analog, power electronics, supercapacitors, tests under high voltage or of relays as well as polarity tests and of course mechanical elements such as magnets, LEDs, displays, etc.

Furthermore, the system offers additional techniques such as optical tests, flashing or RTC calibration, etc.

Advantages

  • Testing power boards with the 3030X offers great advantages:
  • The failure rate during the final function test (end-of-line test) is almost zero
  • Reliable and precise diagnosis at component level significantly reduces repair costs. A long and time-consuming search for the cause of the error is no longer necessary.
  • Early error detection ensures optimized workflows and processes
  • Test equipment for functional and end-of-line testing can be simplified, reducing overall test time.

Highlights

Automated handling of large boards
Operator-free operation, direct integration into SMT lines or test cells

Complete tests
No failures during final functional/EOL test, reduction of field returns.

High throughput
Niedrigste Testkosten, Fähigkeit, die Taktzeit der SMT-Linie einzuhalten

Multifunction tester: 100% coverage with just 1 device

From manufacturing defects analyzers to high-performance systems, SPEA board testers offer the superior solution for parametric and dynamic functional tests at component, cluster and board level. We test 100% of all electronic, mechanical and electromechanical components on the assembly.

Testperformance

The SPEA 3030X offers a comprehensive range of test techniques and detects defective components and process faults safely and reliably. This reduces the occurrence of failures or undetected faults in the function test and thus also the risk of field returns.

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SPEA 3030T Function and end-of-line tester

  • Cost-effective, reliable functional tests
  • Multifunctional tests for unique test coverage
  • High configurability, complete modularity
  • Compact and ergonomic design

The SPEA 3030 Tower is a new, compact tester that has been specially developed for cost-effective, comprehensive functional testing of electronic assemblies and modules.

Standard systems, freely configurable according to the test requirements. Or built-to-order to meet special customer requirements.

SPEA function testers are used worldwide for functional testing of fully assembled electronic modules and systems.

Electronic modules, power supplies, inverters, PLCs, smartphones, vehicle control units and engine control units are just a few examples of the various applications of these SPEA systems.

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SPEA T100

Calibration + electrical test + optical test + mechanical test.
Up to 8 freely movable test heads. All in one system.

 

Highlights

ATE – Automatic test system, fully programmable and applicable for different products
Calibration, test, inspection and flashing of micro-optics, MEMS, sensor technology, microelectronics and micromechanics
Fully integrated and synchronised electrical, optical and mechanical stimulation via freely movable actuators, up to 4 above and 4 below
Configurable tools and instruments (top and bottom)
Configured as an inline system

The very first optomechatronics tester
on a Flying Probe basis

The T100 is a newly developed system from SPEA for testing and calibrating electronic devices and assemblies of all kinds that contain electronic, optical and mechanical functions. This is done by using the latest technologies from the fields of optics, MEMS, sensors, microelectronics and micromechanics.
The T100 can be equipped with different tools and actuators that perform calibrations, electrical, mechanical and optical tests.
And all this with just one system – no additional test systems necessary.
The new SPEA T100 offers the optimal and universally applicable solution for a wide variety of products and for production with many variants.

Fully configurable

The SPEA T100 can be equipped with up to 4 freely movable test heads (XY) each on the top and the bottom side, on which various actuators can be mounted, such as:

  • Pressure actuators for testing, calibrating and measuring all pressure-sensitive objects (keyboards, push buttons, 3D displays, flexible devices)
  • Z-actuators for moving optical and electrical tools on the Z-axis
  • Laser module for testing, calibrating and measuring mechanical dimensions, deformations and planarities
  • Exposure meter for calibrating and measuring a wide variety of light sources such as LEDs, LIDAR systems and displays
  • Light source for testing, calibrating and measuring light sensors or LIDAR sensors
  • Cameras to check for presence, alignment, shape of components and parts, hole dimensions, scratches or dust on the product surface.
  • Sound module for testing, calibrating and measuring sound emission devices (buzzer, loudspeaker)
  • Motorised screwdriver for assembling, screwing and calibrating mechanical or electromechanical devices

Testperformance

  • Electrical: Parametric Test, Performance Test, Functional Test, Waveform Capture, RF Test, 5G Test,Flashing
  • Dimensional: Homogeneity test, correct position test, correct dimensions test, 3D scan test (shape and profile).
  • Mechanical: Pressure test, movement test (travel test), grip test (swipe test)
  • Optical: Checking measured values, AOI, light test, laser test, character recognition, hole measurement, surface test, solder paste test
  • Thermal: temperature recording, temperature control

The tester can be configured as an inline version. The assemblies are identified using 2D barcode or RFID readers.
On some models of the SPEA T100, a movable platform can be installed in the lower test area, which can be equipped with additional actuators and other test tools.
The SPEA T100 uses the ATOS system software, which offers automatic test generation and the highest test coverage.

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SPEA 3030IL In-Circuit Tester

4-fold parallel test, ultra-fast handling.
No operator required. Minimal testing costs.

Highlights

  1. 4x throughput with quad-core architecture
  2. No costs for operating personnel
  3. Ultra-fast handling in 3 seconds
  4. 5000+ tests/sec.
  5. Automatic test program generation
  6. Parallel programming of ICs of different types

High Volume. High quality.
Low test costs.

The SPEA 3030 Inline is optimized for use in automated production environments. It can be easily integrated into SMEMA production lines or combined with standard automatic loading and unloading systems. The system has a modular design and can be configured according to customer requirements. In addition to the in-circuit test, the SPEA 3030 Inline also performs digital tests and tests power electronics assemblies.

Quad-core for parallel tests

The SPEA 3030 Inline can be configured as a multi-core system with up to 4 independent cores – each with independent CPU, local memory and instrumentation. This allows up to 4 assemblies to be tested simultaneously. The throughput of the SPEA 3030 Inline is thus up to 400% higher, which minimizes test costs.

Ultra-fast handling

The SPEA 3030 Inline is equipped with a redesigned handling module that halves the handling time compared to the previous model. 3 seconds are enough to handle a medium-sized assembly – including loading, pressing on and releasing the adapter and final unloading.

Adapter and test program are compatible with the manually operated variants of the system family

The SPEA 3030 Inline is fully compatible with systems that are operated manually. You can switch from an inline tester to a manual tester and vice versa. This means that debugging can be carried out on a manual system and the inline system can continue to be used in production.

Maximum throughput thanks to multi-stage

Using the multi-stage option, the SPEA 3030 Inline can perform various test procedures simultaneously (e.g.: in-circuit + function test, in-circuit + flashing, etc.). This optimizes the test time and reduces costs.

No operating personnel

The SPEA 3030 Inline does not require any operating personnel. The system works fully automatically in inline production or with loaders and unloaders. It is controlled via SMEMA or HERMES. This increases throughput and drastically reduces testing costs.

Highest test speed

Compared to conventional needle bed testers, the test speed of the SPEA 3030 is significantly higher. A dedicated CPU in each core guarantees delay-free communication between instruments and PC. High-performance relays ensure fast switching times. The system architecture minimizes the setup of the instruments. It is also possible to carry out different measurements simultaneously with a single core.

Controlled contacting with motorized receiver

The electromechanical contacting unit is integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation, and signal integrity is guaranteed. The test system and adaptation were developed by SPEA as a reliable and cost-effective turnkey test solution. The contacting of the assembly is safe and precise. The contact pressure speed of the receiver can be set specifically for the test specimen. The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parallel flashing of several components

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Parametric ICT at maximum speed

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

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SPEA 3030M In-Circuit Tester

Complete fault coverage
High throughput. High scalability.

Highlights

  1. Parallel tests reduce test costs
  2. Multifunction: complete fault coverage
  3. Customizable & flexibly retrofittable
  4. Testing power electronics with the SPEA power modules
  5. Automatic test program creation
  6. Parallel programming of ICs of different types

Multifunctional test options:
100 % coverage with just 1 system.

The SPEA 3030 Multimode is a multifunctional, modular test system that can be configured to customer specifications. It offers complete fault coverage in combination with minimized test costs.

SAVE MONEY – Why buy several testers when you only need one? All tests can be carried out with the SPEA 3030 Inline: Incircuit, cluster and function test, as well as on-board programming and boundary scan. Compared to several test stations, the advantages are enormous: no additional operating personnel, a single test program, reduced floor space and lower operating costs.

SAVE TIME – Drastically reduce testing time with the SPEA 3030 Inline.
The SPEA-specific system architecture with special processors enables different test sequences to be carried out. Redundancies, time-consuming handling and testing of assemblies at several test stations are eliminated. The assemblies pass through the SPEA 3030 Inline once and are tested completely and efficiently.

REDUCING FIELD PRESSURE RUNS – The SPEA 3030 was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 reliably finds faults that cannot be detected by conventional ICT testers.

Quad-core for parallel tests

The SPEA 3030 Multimode can be equipped with up to 4 cores, each with independent CPU, local memory and instrumentation. This allows up to 4 assemblies to be tested in parallel. This reduces testing costs by up to 75% compared to standard ICT testers. You only need one tester, one handling procedure, one adapter and one PC to test four assemblies simultaneously.

Parallel flashing of several components

The SPEA 3030 Multimode can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.)

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The contacting of the assembly is safe and precise. With the electromechanical SPEA drawer receiver, the contact pressure speed can be set specifically for the test specimen.
The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Multimode was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Multimode reliably finds faults that cannot be detected by conventional ICT testers.

Testperformance

  • Boundary Scan
    Boundary Scan is used when physical access to individual circuit parts is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Multimode enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030 Multimode not only offers functional tests at component level, but also at cluster and board level. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • True-Per-Pin architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Parametric ICT at maximum speed
    The parametric-dynamic high-speed ICT of the SPEA 3030 Inline checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.
  • Transfer of test programs and adapters to other testers
    The SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

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SPEA 3030CE In-Circuit Tester

High throughput. High error coverage.
Fully compatible with the SPEA 3030 Inline.

Highlights

  1. 2-fold parallel test
  2. Contacting unit compatible with SPEA 3030 Inline
  3. Parametric high-speed ICT
  4. Automatic application development
  5. Diverse test methods

Fully compatible with the SPEA 3030 Inline

The SPEA 3030 Compact extended is a cost-effective needle bed tester with manual handling that is compatible with the SPEA 3030 Inline. The adapter, pressure unit and test program can be quickly and easily ported from the SPEA 3030 CE to the inline tester – and vice versa. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput. It offers a wide range of test procedures and test options as well as 100% fault coverage.

Parallel tests

The SPEA 3030 Compact extended can be equipped with up to 2 cores, each with independent CPU, local memory and instrumentation. This allows up to 2 assemblies to be tested in parallel.

Transfer of adapters and test programs to the SPEA 3030 Inline

The contacting and pressure unit and test program are fully compatible with the SPEA 3030 Inline. You can quickly and easily switch your production from a system with manual operation to a fully automatic system and vice versa, depending on your production requirements.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Parallel flashing of several components

The SPEA 3030CE can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The contacting of the assembly is safe and precise. With the electromechanical SPEA drawer receiver, the contact pressure speed can be set specifically for the test specimen.
The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Inline checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Testperformance

  • True-Per-Pin architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process faults: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030CE not only offers functional tests at component level, but also at cluster and board level. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • Customizable & flexibly retrofittable
    The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely at the
    Purchase or upgrade successively – anything is possible. Third-party measuring instruments can also be easily integrated. The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.).
  • Boundary Scan
    Boundary Scan is used when physical access to individual circuit parts is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact Extended enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).

Learn more >

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