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1

Spectrum II Premier Fluid Dispensing System

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Nordson ASYMTEK’s Spectrum II Premier system enhances the world’s favorite automated liquid dispensing platform (Spectrum II) with the latest technology to produce the most demanding advanced semiconductor packages with applications such as wafer-level packaging and underfill dispensing. The Spectrum II Premier features the latest generation IntelliJet nozzle system with ReadiSet™ Jet Cartridge technology, which takes […]

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Quantum Q-6800 High-Volume Fluid Dispensing System

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The Quantum system with Nordson ASYMTEK’s jet and valve technology is the cost-effective solution for many demanding medium to high complexity fluid dispensing requirements for PCBA, SMT, industrial and other electronic assembly applications, including: CSP, BGA and board-level underfill Corner and edge bonding Dam and fill Potting and encapsulation Surface mount adhesives Conductive epoxy Larger […]