,

SPEA T300

SPEA T300 in-circuit tester with maximum parallelism

32-fold parallel test

The SPEA T300 board tester has a unique tester architecture with up to 32 parallel incircuit test cores and additional capacity of 256 cores for flashing and functional testing. The asynchronous parallel architecture of the SPEA T300 allows testing and parallel flashing of up to 32 PCBAs (Printed Circuit Board Assembly).

The SPEA T300 Needlebed Tester offers SPEA’s unique ICT-Plus technology, which finds electronic faults that are not detected by conventional ICT tests.

Test and flash a variety of assemblies in parallel

Many assemblies are manufactured in the panel, i.e. a few to a large number of assemblies are connected in the panel assembly to form a large printed circuit board. Each of these individual assemblies in turn contains a few to countless components and parts that must be tested and programmed.

SPEA’s new T300 board tester is specifically designed for user testing, or testing and programming many boards at once. It thus guarantees the highest throughput and the lowest testing and programming costs.

 

 

Programmable as single or dual test station

The SPEA T300 can be programmed as a single or dual test station.

In Single Test Site mode, a single board can be ICT and function tested and flashed.

Dual Test Side enables the simultaneous testing of two boards. This applies to ICT, flash programming and functional testing. To double the throughput, the tester can perform a split test. At Station 1, for example, an ICT is performed while at Station 2 either flashing or a functional test is performed simultaneously.

Operatorless testing

The SPEA T300 can be configured in several automated operating modes that operate unattended

  • Inline loading – Inline unloading
  • Loading from rack – inline unloading [1]
  • Inline loading – unloading in rack [1] [2].
  • Loading from rack – unloading into rack [1] [2].

[1] Option: Rack loading by robot
[2] Option: Pass/Fail sorting

In-circuit tester – connected to the digital ecosystem

The SPEA T300 interacts with the Industrie 4.0 environment and digital ecosystem – in terms of information, notifications, programming commands and machine instructions.

The tester has sensors to detect and observe the environment, wear parts and moving parts, electrical and pneumatic power supplies, and internal and external power supplies. This enables him to:

  • Support for predictive maintenance
  • Error detection in advance, which would lead to malfunctions
  • Estimation of wear and remaining service life of machine parts

The SPEA T300 is designed for continuous and intensive use even in harsh manufacturing environments. Easy to maintain – maintenance can be performed easily and quickly.

ATOS Leonardo 4 ICT is the T300 version of the ATOS system software developed by SPEA for its testers.

ATOS contains all the operating and programming functions needed for the tester. This makes you independent of the Windows® version and the configuration and performance of the system PC.

 

 

Other testing systems ->

Our partner

 

/by
,

SPEA 3030IL In-Circuit Tester

SPEA 3030 inline

SPEA 3030 Inline – 4-fold parallel testing, ultra-fast handling.
No operator required. Minimal testing costs.

Highlights of the SPEA 3030 inline

  1. 4x throughput with quad-core architecture
  2. No costs for operating personnel
  3. Ultra-fast handling in 3 seconds
  4. 5000+ tests/sec.
  5. Automatic test program generation
  6. Parallel programming of ICs of different types

High Volume. High quality.
Low testing costs.

The SPEA 3030 Inline is optimized for use in automated production environments. It can be easily integrated into SMEMA production lines or combined with standard automatic loading and unloading systems. The system has a modular design and can be configured according to customer requirements. In addition to the in-circuit test, the SPEA 3030 Inline also performs digital tests and tests power electronics assemblies.

Quad-core for parallel tests

The SPEA 3030IL can be configured as a multi-core system with up to 4 independent cores, each with its own CPU, local memory, and instrumentation. This allows up to 4 assemblies to be tested simultaneously. The throughput of the SPEA 3030 Inline is thus up to 400% higher, which minimizes test costs.

Ultra-fast handling

The SPEA 3030IL is equipped with a newly designed handling module that halves handling time compared to the previous model. 3 seconds are enough to handle a medium-sized assembly – including loading, pressing on and releasing the adapter and final unloading.

Adapter and test program are compatible with the manually operated variants of the system family

The SPEA 3030 Inline is fully compatible with systems that are operated manually. You can switch from an inline tester to a manual tester and vice versa. This means that debugging can be carried out on a manual system and the inline system can continue to be used in production.

Maximum throughput thanks to multi-stage

With the multi-stage option, the SPEA 3030IL can perform various test procedures simultaneously (e.g., in-circuit + functional test, in-circuit + flashing, etc.). This optimizes the test time and reduces costs.

No operating personnel required for the SPEA 3030 inline

The SPEA 3030IL does not require any operating personnel. The system works fully automatically in inline production or with loaders and unloaders. It is controlled via SMEMA or HERMES. This increases throughput and drastically reduces testing costs.

Highest test speed

Compared to conventional needle bed testers, the test speed of the SPEA 3030 is significantly higher. A dedicated CPU in each core guarantees delay-free communication between instruments and PC. High-performance relays ensure fast switching times. The system architecture minimizes the setup of the instruments. It is also possible to carry out different measurements simultaneously with a single core.

Controlled contacting with motorized receiver

The electromechanical contacting unit is integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation, and signal integrity is guaranteed. The test system and adaptation were developed by SPEA as a reliable and cost-effective turnkey test solution. The contacting of the assembly is safe and precise. The contact pressure speed of the receiver can be set specifically for the test specimen. The lowering is always absolutely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parallel flashing of several components

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Parametric ICT at maximum speed

The SPEA 3030 Inline can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

 

Other test systems ->

Learn more >

/by
,

SPEA 3030M In-Circuit Tester

SPEA 3030M

Complete error coverage
High throughput. High scalability.

Highlights of the SPEA 3030M

  1. Parallel tests reduce test costs
  2. Multifunction: complete fault coverage
  3. Customizable & flexibly retrofittable
  4. Testing power electronics with the SPEA power modules
  5. Automatic test program creation
  6. Parallel programming of ICs of different types

Multifunctional testing capabilities:
100% coverage with just one system.

The DSPEA 3030M test system is a multifunctional, modular test system that can be configured to customer specifications. It offers complete fault coverage in combination with minimized test costs.

SAVE MONEY – Why buy several testers when you only need one? All tests can be performed with the SPEA 3030M Inline: in-circuit, cluster, and functional tests, as well as on-board programming and boundary scan. Compared to several test stations, the advantages are enormous: no additional operating personnel, a single test program, reduced floor space and lower operating costs.

SAVE TIME – Drastically reduce test time with the SPEA 3030 Inline.
The SPEA-specific system architecture with special processors enables different test sequences to be performed. Redundancies, time-consuming handling and testing of assemblies at several test stations are eliminated. The assemblies pass through the SPEA 3030 Inline once and are tested completely and efficiently.

REDUCING FIELD FAILURES – The SPEA 3030M was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 reliably finds faults that cannot be detected by conventional ICT testers.

Quad-core for parallel tests

The SPEA 3030 Multimode can be equipped with up to 4 cores, each with independent CPU, local memory and instrumentation. This allows up to 4 assemblies to be tested in parallel. This reduces testing costs by up to 75% compared to standard ICT testers. You only need one tester, one handling procedure, one adapter and one PC to test four assemblies simultaneously.

Parallel flashing of several components

The SPEA 3030 Multimode can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Customizable & flexibly retrofittable

The uncompromising flexibility of our testers guarantees an individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.)

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The assembly is contacted securely and precisely. With the SPEA electromechanical drawer receiver, the contact pressure speed can be adjusted to suit the specific test piece.
The lowering process is always completely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Multimode was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Multimode reliably finds faults that cannot be detected by conventional ICT testers.

Testperformance

  • Boundary scan
    Boundary scan is used when physical access to individual circuit components is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Multimode enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process errors: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030 Multimode offers function tests not only at the component level, but also at the cluster and board levels. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • True-Per-Pin Architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Parametric ICT at maximum speed
    The parametric-dynamic high-speed ICT of the SPEA 3030 Inline tests the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.
  • Transfer of test programs and adapters to other testers
    SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

 

Other test systems ->

Learn more >

/by
,

SPEA 3030CE In-Circuit Tester

SPEA 3030CE

High throughput. High fault coverage.
Fully compatible with the SPEA 3030 Inline.

Highlights

  1. 2-fold parallel test
  2. Contacting unit compatible with SPEA 3030 Inline
  3. Parametric high-speed ICT
  4. Automatic application development
  5. Diverse test methods

Fully compatible with the SPEA 3030 Inline

The SPEA 3030 Compact extended is a cost-effective needle bed tester with manual handling that is compatible with the SPEA 3030 Inline. The adapter, pressure unit and test program can be quickly and easily ported from the SPEA 3030 CE to the inline tester – and vice versa. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput. It offers a wide range of test procedures and test options as well as 100% fault coverage.

Parallel tests

The SPEA 3030 Compact extended can be equipped with up to 2 cores, each with independent CPU, local memory and instrumentation. This allows up to 2 assemblies to be tested in parallel.

Transfer of adapters and test programs to the SPEA 3030 Inline

The contacting and pressure unit and test program are fully compatible with the SPEA 3030 Inline. You can quickly and easily switch your production from a system with manual operation to a fully automatic system and vice versa, depending on your production requirements.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Parallel flashing of several components

The SPEA 3030CE can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The assembly is contacted securely and precisely. With the SPEA electromechanical drawer receiver, the contact pressure speed can be adjusted to suit the specific test piece.
The lowering process is always completely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Inline checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Testperformance

  • True-Per-Pin Architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process errors: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030CE offers function tests not only at the component level, but also at the cluster and board levels. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • Customizable & flexibly retrofittable
    The uncompromising flexibility of our testers ensures individual configuration that optimally meets the respective test requirements. You can either configure your tester completely at the time of purchase or retrofit it gradually—anything is possible. Third-party measuring instruments can also be easily integrated. The wide range of adaptation options, such as drawer receivers and plug interfaces, are outstanding. Inline contacting unit, Pylon interface but also customer-specific interfaces or receivers from third-party suppliers (Genrad, Ingun, Zentel, etc.).
  • Boundary scan
    Boundary scan is used when physical access to individual circuit components is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact Extended enables broader fault coverage while simultaneously reducing adapter costs (virtual test points instead of real test needles).

Other testing systems ->

Learn more >

/by
,

SPEA 3030C In-Circuit Tester

SPEA 3030 Compact

SPEA 3030 Compact – Kleine Standfläche, hohe Fehlerabdeckung

Highlights

  1. 2-fold parallel test
  2. Low space requirement
  3. Parametric high-speed ICT
  4. Automatic application development
  5. Wide range of test methods: ICT, FKT, flashing

Compact. Powerful.

The SPEA 3030 Compact is designed for fast and cost-effective in-circuit testing. With a small footprint, it offers maximum testing possibilities. The tester has a modular design, can be configured to customer specifications and, thanks to the dual-core parallel tests, it enables twice the throughput of conventional ICT testers with 100% fault coverage.

Parallel tests

The SPEA 3030 Compact can be configured as a multi-core system with up to 2 independent cores – each with independent CPU, local memory and instrumentation.

Reduce testing costs

The multi-core architecture drastically reduces testing costs. You only need one tester, one handling procedure, one adapter and one PC to test two assemblies simultaneously.

PC-independent architecture

With the PC-independent architecture of the SPEA 3030, the test program runs in the tester’s CPU and the test speed is determined by this. This also ensures that PC background programs do not affect the test speed. In addition, the PC can be updated or replaced at any time without having to debug test programs again.

Reduction of field returns

Reduction of field returns – The SPEA 3030 Compact was developed to help electronics manufacturers ensure the quality of their products. By using innovative test techniques, the SPEA 3030 Compact reliably finds faults that cannot be detected by conventional ICT testers.

Parallel flashing of several components

The SPEA 3030 Compact can be equipped with one or more flashing modules. This allows both identical and different components to be programmed in parallel. Flashing times and costs are significantly reduced.

Precise contacting with receivers from SPEA

The contacting units are integrated directly into the test system. This means that there are no interfering cables between the system modules and the adaptation. Signal integrity is guaranteed. The test system and adaptation are supplied by SPEA as a reliable and cost-effective turnkey test solution.
The assembly is contacted securely and precisely. With the SPEA electromechanical drawer receiver, the contact pressure speed can be adjusted to suit the specific test piece.
The lowering process is always completely planar. The contacting level is freely programmable in steps of 100 µm. This allows different contacting levels to be realized, for example for 2-stage contacting during the function test.

Parametric ICT at maximum speed

The parametric-dynamic high-speed ICT of the SPEA 3030 Compact checks the parameters of each individual component according to the data sheet. These tests are generated automatically with the help of component libraries. This means short program creation times, short test times and maximum error coverage rates.

Test performance of the SPEA 3030 Compact

  • True-Per-Pin Architecture
    SPEA’s direct pin electronics guarantee reliable testing of complex analog or digital assemblies. When not multiplexed, the pin electronics provide a completely independent stimulus and measurement channel on each channel (1:1). This offers several advantages: faster test generation, simple ECO management, full flexibility.
  • Open pin detection
    Two different test techniques are available to clearly identify unsoldered pins (open pins) and other process errors: Electro Scan and Junction Scan.
  • Function test
    The SPEA 3030 Compact offers function tests not only at the component level, but also at the cluster and board levels. Parameterization is carried out in the Leonardo system software or optionally using higher programming languages such as Microsoft C++, Visual Basic, Borland, Delphi, LabView, etc.
  • Customizable & flexibly retrofittable
    The uncompromising flexibility of our testers ensures individual configuration that optimally meets the respective test requirements. You can either configure your tester completely when you buy it or upgrade it gradually – anything is possible. Third-party measuring instruments can also be easily integrated.
    The wide range of adaptation options is outstanding, including drawer receivers, plug interfaces, inline contact units, pylon interfaces, as well as customer-specific interfaces or receivers from third-party providers (Genrad, Ingun, Zentel, etc.).
  • Boundary scan
    Boundary scan is used when physical access to individual circuit components is not possible. This means that highly complex assemblies, fine-pitch technology, multilayers and BGAs can be tested without direct contact with the test probes. The parallel use of boundary scan technology and the system modules of the SPEA 3030 Compact enables broader fault coverage while reducing adapter costs (virtual test points instead of real test probes).
    Transfer of test programs and adapters to other testers
    SPEA testers are based on a common system architecture. The hardware and software platform is designed so that test programs and adapters can be transferred from one system to another. For the test programs, this applies not only within the SPEA 3030 system family, but also between board and flying probe testers. This enables the greatest possible flexibility in production.

Autres systèmes de test ->

Learn more >

/by
,

SPEA 3030R In-Circuit Tester

SPEA 3030R

SPEA 3030R In-Circuit Tester – maximum test performance without additional space requirements

The SPEA 3030R In-Circuit Tester is a powerful test system that combines maximum precision with a space-saving design. As a rack version of the successful SPEA 3030 series, it offers multifunctional testing capabilities and can be seamlessly integrated into existing production cells and automation systems. The tester thus enables maximum efficiency in a minimum of space.

Space-saving design with full testing performance

The SPEA 3030R in-circuit tester reduces the space required for production to zero. The system can be installed directly in a 19″ housing or integrated into existing third-party systems via a plug-in interface. This design not only saves valuable space, but also reduces costs, as existing mechanical structures and frames can be used.

Multifunctional test platform for maximum accuracy

The SPEA 3030R in-circuit tester offers an impressive range of test techniques, all combined in a compact test station. It supports:

  • In-circuit tests (analog, digital, mixed)
  • Power-up tests
  • functional tests
  • Flashing via embedded programming
  • Open-Pin-Scan
  • Boundary Scan
  • Built-In-Self-Test
  • Parametrische Tests

With this variety of test methods, the tester offers complete fault coverage—from production faults to complex electrical faults.

PC-independent architecture for stable test results

Like all systems in the 3030 series, the SPEA 3030R in-circuit tester has its own CPU. The test program runs directly on the tester, which means that external PC processes do not affect the test speed. This ensures stable and reproducible results. In addition, the PC can be replaced or updated at any time without the need for re-debugging.

Powerful, reliable, and easy to use

Thanks to the powerful Leonardo system software, the SPEA 3030R in-circuit tester is easy to use. Functions such as auto-debug and auto-tuning accelerate test development and increase measurement stability. This allows test programs to be generated quickly and production downtime to be avoided.

Ideal for modern production environments

The SPEA 3030R in-circuit tester offers all the advantages of the SPEA 3030 family—high measurement accuracy, modular architecture, and unlimited flexibility—in a compact space. Its integration into existing systems ensures maximum signal integrity and reduces signal loss. This makes it the perfect solution for manufacturers who value efficiency, precision, and cost savings.

Other testing systems ->

Learn more >

/by
,

SPEA 3030BT In-Circuit Tester

SPEA 3030BT

SPEA 3030BT – Testing has never been easier

SPEA 3030BT In-Circuit Tester – compact, precise, powerful

The SPEA 3030BT In-Circuit Tester is a compact and cost-effective tester for precise electronics testing. Despite its small footprint, it offers the full performance of the SPEA 3030 series. With modern technology, simple operation, and flexible integration, the tester is the ideal solution for manufacturing environments with limited space and high quality requirements.

Simple testing with maximum efficiency

Testing has never been easier than with the SPEA 3030BT in-circuit tester. The user-friendly Leonardo system software enables automatic test program creation and fast debugging. In just a few steps, the software guides the user from data import to a stable test program. The system can be connected to a PC or notebook via USB and used immediately—uncomplicated, efficient, and reliable.

High testing performance in the smallest of spaces

The SPEA 3030BT in-circuit tester requires minimal space and can be used both as a benchtop device and in a standard 19″ rack. Its ergonomic design with front handles facilitates transport and makes it the perfect solution for flexible production environments. Despite its compact size, the tester operates with the same powerful hardware modules as larger systems in the SPEA 3030 series.

PC-independent architecture for stable performance

The internal CPU of the 3030BT in-circuit tester ensures that the test program runs independently of the PC. This keeps the test speed constant—even if the connected computer is executing other processes or is replaced. This architecture increases operational reliability and minimizes downtime in the production process.

Reliable error detection and test coverage

The SPEA 3030BT in-circuit tester offers comprehensive testing capabilities, including:

  • In-circuit testing for short circuits, open pins, and faulty components
  • Open pin detection through Electro Scan and Junction Scan
  • True per-pin architecture with 1:1 independent measurement channels
  • 16-bit instrumentation and 8-wire measurements for maximum accuracy

These technologies enable precise identification of process errors that are often overlooked by conventional ICT testers.

Modularity and future-proofing

Thanks to its modular architecture, the SPEA 3030BT in-circuit tester can be flexibly adapted to individual requirements. Manufacturers benefit from a durable test solution that can be easily expanded and modernized—an investment that pays off in the long term.

Other test systems ->

Learn more >

/by